Very large scale integrated planar read only memory

ABSTRACT

An improved precharge timing control is provided by turning off the first one of a series of precharge clocks PC0 by means of discharging a single dummy word line. The dummy word line is comprised of a plurality of dummy word line segments wherein each of the segments are charged in parallel, but discharged in series. The discharge time required of the plurality of word line segments is sufficient to allow discharge of an end of a selected word line in the read only memory to ground. Improved timing with good performance is achieved by turning off the earliest precharge clock PC0 among a series of precharge clocks PC0 and PC1, for example, so that an improved precharge time for the ROM core for a fast process parameter is realized.

RELATED CASES

This is a divisional of application Ser. No. 08/426,037 filed on Apr.21, 1995, now U.S. Pat. No. 5,546,544, which is a continuation-in-partof U.S. patent application, Ser. No. 07/538,185, entitled ImprovedSemiconductor Read-Only VLSI Memory, which is incorporated herein byreference, filed on Jun. 14, 1990, now abandoned.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to improvements in a read-only memory. Inparticular the invention relates to a VLSI memory array prechargeimprovement, a latch circuit improvement to minimize metastability indynamic digital circuits,

2. Description of the Prior Art

Memory Array Precharge

FIG. 19 of the parent application referenced above shows a prechargedcircuit whose operation is illustrated in the timing diagram of FIG. 20of that same application. The architecture of this memory array iscomprised of four blocks: (1) a Y-decoder block for the high addressportion; (2) a Y-decoder block for the low address portion; (3) a memorycell block; and (4) a precharge block. The memory array is provided witha precharge voltage, VPC. Charging and discharging the bit lines arecontrolled by the signals, SELV, PC0, PC1 and PC2.

PC2 serves to precharge the bit line from the memory array itself. PC2provides a bit charge which charges only selected bit lines which areconnected to a sense amplifier to a certain precharge level.

PC1 is then coupled in common to the gates of a plurality of prechargedtransistors which are coupled in series with each virtual ground lineand bit line within the memory cell block. PC1 is therefore used as ablanket precharge and charges all bit lines and source side select linesto a predetermined charge level.

PC0 is coupled in common to the gates of the precharged transistorswithin the memory array, which transistors are coupled between adjacentbit lines in the array similar to that as shown in FIG. 18 of the parentapplication incorporated above. The precharged transistors short each ofthe bit lines together to allow a precharge to be coupled through thetransistors to all the bit lines within the memory block. PC0 istherefore a bank precharge signal. PC0 charges all the bit lines in aselected bank which are precharged and shorted together so that theprevious charge from any previously selected memory cell access withinthe block is eliminated. The bit lines are precharged equally with apredetermined precharged level.

The control signal, SELV, is a select virtual ground command which pullsthe source side of a selected memory cell bit to ground level.

The address lines YDLi and YDUi, corresponding to the lower and upperaddress bits, are typically low during precharge. Only one address lineYDLi and one address line YDUi are driven high during the evaluate orread cycle.

Metastable Latch Circuit

In memory circuits or other dynamic digital circuits, latches are usedto accepts various signals, such as addresses to implement the read orwrite signal with proper timing. In some cases the latch is likely tofall into a metastable state which can cause a dynamic ROM, for example,not to accept any new address transitions or to cause a dynamic ROM tooutput incorrect data. To avoid latch contentions design modificationsof the latches are used which introduce time delays. These delays thenmust be accommodated by the logic design of the architecture. What isneeded is a latch design which is not susceptible to failure in latchcontentions and which is transparent insofar as the timing of thecircuitry is concerned.

Data Multiplexing in Very Large Scale Integrated Memories with OptimumOperating Speed

FIG. 6 illustrates a typical prior art, read-only memory in which thememory core is divided into a left core half 62 and right core half 64.Each core half 62 and 64 produces eight bits or one byte of the outputword. The bytes are multiplexed through a multiplexer 66 whose output iscoupled to a sense amplifier 68. The output of the sense amplifier inturn is provided as an input to a driver circuit 70 whose output isconnected to the output pads 72 to communicate the left and right bytesin sequence to the outside environment, typically a bus.

The disadvantages of the prior art approach as shown in FIG. 6 is thatboth halves of the memory core 62 and 64 must be powered up and coupledthrough multiplexer 66 to sense amplifier 68. The chip layout for thiscoupling is geometrically complex and generally introduces opportunitiesfor undesirable parasitic effects. The generation of internal noisevoltages within the two memory core halves 62 and 64 also creates aninherent limitation to circuit speed.

Therefore, what is needed is a memory organization and supporting senseamplifier and multiplexer circuitry which overcomes these defects.

A One Shot Pulse Generator for a Very Large Scale Integrated MemoryPrecharge Time Control

The parent application upon which this depends shows the advantages ofdynamic precharge and blanket precharge of all the core elements withina very large scale integrated read only memory. A typical approach togenerate the timing signals is depicted in FIG. 12. The logic circuitryof FIG. 12 determines when to switch the precharge clock PC0 to alogical zero as measured from the start of the memory cycle by means ofseveral cascaded logic gates. The propagation delay time through thecascaded gates determines when PC0 will be switched low. The prior artdesign of FIG. 12 is, however, ill adapted for a CMOS circuitry and moregenerally is difficult to provide an optimum precharge time for the ROMcore because timing control, which is subject to process variations,temperature and supply voltage variations, is very approximate.

Therefore, what is needed is a circuit which will overcome each of thedefects of a memory precharge timing circuit as exemplified by the priorart of FIG. 12.

CMOS Trigger Circuit

A typical NMOS ROM trigger circuit is shown in FIG. 24 of the parentapplication and uses two inputs and has one output which switches ortriggers from a logical zero to a logical one when the input rampsdownwardly relatively slowly to about 0.2 volts less than the secondinput.

What is needed is a CMOS sense circuit which includes an automatic quickpower-down to zero after the output switches have switched to a logicalone. Further, also what is need is a trigger circuit which can triggeron less than 0.2 voltage difference in the inputs.

One-shot Pulse Generator for VLSI Memory Timing Control

FIG. 21 in the copending parent application shows NMOS ROM timingcontrol circuit which determines by means of a word dummy line andassociated control logic gates the time at which to switch the prechargeclock, PC0, to 0 as measured from the start of a memory cycle. Theprecharge clock, PC0, is not switched to 0 until the output of the dummyword line delay circuit, OWUP, has switched low.

This design is not compatible with CMOS processing and requires the useof two dummy word lines. The prior art circuit also has no means forpowering-down when inactive and therefore continues to use power evenwhen inactive. Therefore, what is needed is a timing control circuitwhich is not subject to each of these limitations of the prior art.

RC Delay Circuit To Block Address Transition Detection

Means have previously been described in the parent copending applicationfor blocking address transition detection at the time that outputbuffers are changing through the use of a timing circuit whose output isSURG. However, the circuitry there described in connection with FIG. 35of the copending parent application is not adapted to a CMOS process,and is based upon logic gates and inherent delays in those gates. Thesedelays are subject to variations in process parameters and operatingvoltages. Therefore, what is needed is a delay circuit which can blockaddress transition detection in a controlled manner without beingsubject to these process and operating voltage variations.

CMOS Sense Amplifier/Latch Circuit for a Single Data Input Signal

The NMOS read-only memory sense amplifier described in the parentapplication upon which this application copends used four inputs and hada latch function. This design is ill adapted to the CMOS environment.Further, improved data latch operation would be desired to provide sometype of means for increasing immunity to bit line noise. Still further,it would be advantageous to power-down the sense amplifier to zero powerdissipation while retaining the latched data.

A Low Noise X Decoder Circuit for Use in a Semiconductor Memory

X decoders used in addressing memories provide a selection function bywhich a particular polysilicon or polycide word line is moved from alower, off-voltage state to a higher on-voltage state with all wordlines held low. The particular word line which is selected is determinedaccording to the voltages or signals on the multiple address inputlines. Each unique combination or configuration of addresses selects oneunique word line. Conventional read-only memories, random accessmemories or programmable read-only memories have X decoders which aredesigned using stages of logic gates, NAND and NOR gates followed bybuffers. In the case of NMOS technology, voltage pumps are used toinsure fall scale voltage expressions.

This prior art approach is particularly susceptible to noise of a typewhich the present invention suppresses. Noise in the X decoder is aproduct of the decoder design and becomes apparent in very largememories which are now beginning to be built.

Therefore, what is needed is a means for suppressing the unique type ofelectrical noise which occurs in these types of X decoders.

Improved Time Constant Generation Circuit

The accurate control of circuits used in semiconductor memories is basedupon the availability of a stable time reference. Typically, for thesake of simplicity and cost, an RC time circuit is provided usingintegrated resistive and capacitive elements. Typical prior artapproaches for creating time delays have used: (1) pair delay integratedcircuit logic elements; (2) RC time delay using integrated elements; (3)RC time delays using hand-selected resistive and/or capacitive externalelement; and (4) crystal based tuning elements using external crystalsand connectors. Each of these supposes varying cost and accuracyproportionately with the first approach being the least costly andaccurate and the last being the most costly and accurate.

What is needed is a means for utilizing low cost timing approaches suchas described in the first and second options above, but to do so withaccurate results not typical of those prior an approaches.

Memory Circuit Yield Generator and Timing Adjustor

The use of a dummy decoder in a semiconductor memory to obtain anoptimum sense time and to provide adjustment for device leakage,capacitance loading, transistor characteristics and the like is wellknown. However, no means has been devised to provide for higherproduction yields in such dummy decoders when the circuit being producedhad a slower speed requirement.

BRIEF SUMMARY OF THE INVENTION

Memory Array Precharge

The invention is an improvement in a read only memory comprising amemory core having a plurality of memory cells. The memory cells areaccessed at least in part by selection of corresponding bit lines andvirtual ground lines. The improvement comprises a top prechargingcircuit for precharging the ROM core as controlled by a first prechargeclock. The top precharging circuit is physically disposed at a first endof the bit lines and of virtual ground lines disposed in the ROM core.The bottom precharging circuit is coupled to the ROM core forprecharging the bit lines and virtual ground lines and is controlled bya second precharge clock. The bottom precharge circuit is disposed inthe ROM core at an opposing end of the bit lines and ground linesopposite from the first end of the bit lines and virtual ground lines.As a result, precharging time for the ROM core is significantly reduced.

The improvement further comprises a predecoder circuit. The predecodercircuit is controlled by the second precharge clock. A second clocksignal is generated by the second precharge clock causing the predecoderto precharge the ROM core through the bottom precharge circuit. Thepredecoder circuit further provides decoded bit line and virtual groundline select signals for reading the ROM core when the second clocksignal is inactive.

The predecoder circuit is comprised of a lower address predecodercircuit and an upper address predecoder circuit. Precharging of the ROMcore is performed in both the upper address predecoder circuit and thelower address predecoder circuit.

The lower address predecoder circuit selects bit lines and adjacentvirtual ground lines in the ROM core for precharging through the upperaddress predecoder circuit.

The invention is also characterized as an improvement in a methodperformed in a read only memory comprising a memory core having aplurality of memory cells. As before the memory cells are accessed atleast in part by selection of corresponding bit lines and virtual groundlines. The improvement comprises the steps of precharging the ROM coreas controlled by a first precharge clock at a first end of the bit linesand of virtual ground lines disposed in the ROM core. The bit lines andvirtual ground lines are precharged as controlled by a second prechargeclock at an opposing end of the bit lines and ground lines opposite fromthe first end of the bit lines and virtual ground lines. As a result,precharging time for the ROM core is significantly reduced,

The improvement further comprises the step of providing decoded bit lineand virtual ground line select signals for reading the ROM core when thesecond clock signal is inactive. The step of providing decoded bit lineand virtual ground line select signals for reading the ROM corecomprises the steps of precharging of the ROM core by circuit of anupper address predecoder and the lower address predecoder.

The improvement further comprises the step of selecting a bit line andadjacent virtual ground lines in the ROM core for precharging throughthe upper address predecoder circuit.

A Latch Circuit Improvement to Minimize Metastability in Dynamic DigitalCircuits

The invention is an improvement in a digital dynamic circuit comprisinga first circuit for receiving an address transition detection (ATD)signal and selectively outputting its inverse (NSMPA). A second circuitgenerates an address sample signal (SMPA) in response to receipt ofoutput of the first circuit (NSMPA). A third circuit disables the firstcircuit in response to a ground surge control signal (SURG) so that thesample address signal (SMPA) is held logically false regardless of thelogic value of the address transition detection signal (ATD). Otherwisethe third circuit for selectively disabling the sample address signalpermits the second circuit to be operative according to the addresstransition detection signal (ATD)) received by the first circuit. As aresult, noise generated during output driver transitions does not affectaddressing within the circuit.

The first circuit for receiving the address detection signal (ATD) has atrigger point. The trigger point is defined as a signal level of theinput at which the output of the first circuit will begin to change. Thethird circuit and the second circuit also each have correspondingtrigger points. The trigger points of the first circuit and the secondcircuit are lower than the trigger point of the third circuit so thatthe first circuit and the third circuit may enter a metastable outputstate without triggering the second circuit which therefore does nothave a metastable output condition.

The third circuit for selectively disabling the sample address signal(SMPA) and the first circuit for receiving the address transitiondetection signal (ATD) have unbalanced trigger points such that thefirst circuit is favored so that, when input signals are simultaneouslyreceived by the first circuit and the third circuit, the output of thefirst circuit is the ultimately prevailing output condition so that thethird circuit is no longer responsive to the ground surge control signal(SURG) received by the third circuit.

The sample address signal (SMPA) is fed back to the third circuit sothat metastability of the output of the third circuit is minimized.

The first circuit for receiving the address transition detection signal(ATD), and the third circuit for selectively disabling the sampleaddress signal (SMPA) comprise a latch having as a latched input theaddress transition detection signal (ATD). The latch is selectivelydisabled by the ground surge control signal (SURG) and by a prechargeokay signal, (PCOK), indicative of an appropriate memory precharge. Aninverter is coupled to the output (NSMPA) of the latch to generate thesample address signal (SMPA). A disabling gate has the sample addresssignal (SMPA) fed back as an input to it. The disabling gate selectivelypasses or generates the precharge okay signal (PCOK). The disabling gateis disabled by the sample address signal (SMPA) fed back as an inputthereto.

The input coupled to the address detection signal (ATD) of the latch andthe input connected to the ground surge control signal (SURG) of thelatch have input trigger points. The inverter also has an input triggerpoint. The input trigger point of the SURG input to the latch is higherthan the input trigger point of the inverter or the input trigger pointof the ATD input to the latch.

The trigger point of the input coupled to the address transitiondetection signal (ATD) is favored compared to the trigger point of theinput coupled to the ground surge control signal (SURG) so thatsimultaneous receipt of the address detection signal (ATD) and theground surge control signal (SURG) are always resolved within the latchto follow control of the address transition detection signal (ATD).

The invention is also an improvement in the method of operation in adigital dynamic circuit comprising the steps of: receiving an addresstransition detection (ATD) signal; selectively generating an addresssample signal (SMPA) in response to receipt of the address transitiondetection signal (ATD); and disabling generation of the address samplesignal (SMPA) in response to a ground surge control signal (SURG) sothat the sample address signal (SMPA) is held logically false regardlessof the logic value of the address transition detection signal (ATD).Otherwise the sample address signal is selectively disabled according towhether the address transition detection signal (ATD) is received. As aresult, noise generated during ROM data output transitions does notaffect addressing within the circuit.

In the step of selectively generating the address sample signal (SMPA)in response to receipt of the address transition detection signal(ATD)), a trigger point is defined as a signal level of the input atwhich the address sample signal (SMPA) will begin to change. The step ofdisabling also has a corresponding trigger point defined. The triggerpoint of the step of disabling is higher than the trigger point of thestep of selectively generating SMPA. However, a metastable output statemay be entered in response to receipt of the address transitiondetection signal (ATD) and the address sample signal (SMPA) when thesetwo signals are skewed such that they reach the respective triggerpoints simultaneously. The unbalanced trigger points result in themetastable voltage level of NSMPA being higher than the metastable levelof PASS. Having the trigger point of the second circuit less than themetastable voltage level of NSMPA means that the output of the secondcircuit (SMPA) does not have a metastable output condition.

The step of selectively disabling the sample address signal (SMPA) andthe step of receiving the address transition detection signal (ATD) haveunbalanced trigger points such that the step of generating is favored sothat, when input signals are simultaneously received to caused anaddress transition detection (ATD) and to disable generation of thesample address signal (SMPA), the step of generating is the ultimatelyprevailing step and output condition so that receipt of the transitiondetection signal (ATD) is allowed to cause an output (SMPA).

The improvement further comprises the step of feeding back the sampleaddress signal (SMPA) to selectively enable the step of disabling sothat metastability of the step of disabling is minimized.

The steps of receiving the address transition detection signal (ATD),selectively generating the sample address signal (SMPA), and selectivelydisabling the sample address signal (SMPA) comprise the step of latchingthe address transition detection signal (ATD) as a latched input. Thelatch being selectively disabled by the ground surge control signal(SURG) and by a precharge okay signal, (PCOK), indicative of anappropriate memory precharge. The output of the latch is inverted togenerate the sample address signal (SMPA). The sample address signal(SMPA) is selectively fed back to selectively pass the precharge okaysignal (PCOK) to thus selectively disable the step of latching.

The step of latching in response to the address detection signal (ATD)as controlled by the ground surge control signal (SURG) has inputtrigger points defined in the address detection signal (ATD) and theground surge control signal (SURG). The step of inverting also has aninput trigger point. The input trigger points of the step of latchinghave one higher (SURG) and one equal (ATD) to the input trigger point ofthe step of inverting.

Data Multiplexing in Very Large Scale Integrated Memories with OptimumOperating Speed

The invention is an improvement in a read only memory having a left andright core portion comprising a first plurality of sense amplifierscoupled to the left core portion of the read only memory. A secondplurality of sense amplifiers are coupled to the right core portion ofthe read only memory. A multiplexer is coupled to the outputs of thefirst and second plurality of sense amplifiers for selecting only theleft or the right core portions of the read only memory data forcoupling through the multiplexer. A plurality of output drivers arecoupled to the multiplexer for providing output signals fromcorresponding multiplexed ones of the sense amplifiers coupled to theleft or right core portions of the read only memory. As a result, powerdissipation within the read only memory is reduced, and internal noisevoltages within the read only memory are reduced.

The first and second plurality of sense amplifiers are physicallycoupled in close proximity to the left and right core portions of theread only memory to reduce parasitic capacitance in the coupling betweenthe core portions and the first and second plurality of senseamplifiers.

The multiplexer comprises a corresponding first and second plurality oftransfer gates coupled respectively to the first and second plurality ofsense amplifiers. The first and second plurality of transfer gates areselectively disabled according to whether the left or right core portionof the read only memory is selected.

Each of the transfer gates of the first and second plurality of transfergates is a CMOS gate comprising an NFET and PFET. The NFET and PFET areselectively controlled to permit transfer of logic signals through thetransfer gate according to the selection of the left or right coreportion of the read only memory. The plurality of output circuit areCMOS output drivers comprising a PFET and NFET. The NFET and PFET in theoutput driver are controlled by a corresponding gate signal from one ofthe plurality of transfer gates.

The multiplexer has a predetermined rise time and fall time relative toits switching. The predetermined rise time and fall time of themultiplexer are selected so that the plurality of output drivers drivenby the multiplexer have a reduced ground bounce and voltage sourcebounce.

The invention is also an improvement in a method for reading a read onlymemory comprising the steps of selecting one of a left and right coreportion of the read only memory, and coupling the selected core portiondirectly to a corresponding sense amplifier in close physical proximityto the selected core portion to reduce parasitic capacitance and therebyincrease operational speeds. The method further comprises the steps ofmultiplexing the outputs of the sense amplifiers to a plurality ofoutput drivers to read out the contents of the selected core portion ofthe read only memory. The method still further comprises the step ofcontrolling rise times and fall times of the sense amplifiersmultiplexed to the output drivers so that ground bounce and supplyvoltage bounce caused by the output drivers, by virtue of switchingduring the step of multiplexing, is minimized.

A One Shot Pulse Generator for a Very Large Scale Integrated MemoryPrecharge Time Control

The invention is an improvement in a precharge timing circuit for a readonly memory core for generating a precharge signal, PCOK, comprising acircuit element for generating a delayed trigger signal, DMYSECPC, inresponse to initiation of a memory cycle within the ROM core in a mannersimulative of precharging of the main core ROM to compensate for processvariations, temperature and supply voltage variations. Another circuitelement detects when the delayed trigger signal reaches a predeterminedvoltage difference from a reference precharge voltage, VPC, and forswitching the PCOK signal to logical one.

The element for generating the delayed trigger signal selectivelygenerates the delayed trigger signal to simulate precharging of at leastthat portion of the main core ROM coupled to a single bit line.

The element for selectively generating the delayed trigger signal insimulation of main core precharging comprises a dummy array of memorycells of that portion of the main core ROM coupled to a single bit line.

The dummy array of memory cells are programmed to delay the rise of thetrigger signal DMYSECPC to approximately match precharging delaysactually experienced within the main core ROM.

The predetermined voltage difference from the VPC signal, which theslowly rising delayed trigger signal reaches, is approximately 0.3 voltsless than the precharge voltage VPC when the delayed trigger signal isgenerated.

The element for detecting and switching comprises a first CMOSdifferential amplifier and a second CMOS differential amplifier. Thefirst and second differential amplifiers are cascaded together. Thefirst differential CMOS amplifier is a complementary design to that ofthe second CMOS differential amplifier. Complementary design is definedto mean a circuit design adapted to allow each of the principal NFETswithin one CMOS differential amplifier to be replaced with a PFET andvice-versa for each corresponding circuit element within the first andsecond CMOS differential amplifiers without affecting operability of thedesign. The first differential amplifier has outputs coupled directly toinputs of the second differential amplifier. The improvement furthercomprises a CMOS inverter. The CMOS inverter has inputs directly coupledto the outputs of the second CMOS differential amplifier.

The first and second differential amplifiers have input trigger levelvoltages. The trigger level voltages are adapted for presetting atpredetermined levels by varying channel sizes within input FETs withinthe first and second differential amplifiers. The trigger level voltageof the first and second amplifiers is defined as having that magnitudewhich switches the output of the inverter to one-half of the supplyvoltage, VDD.

The trigger level voltage can be set at an increased value. The firstand second differential amplifiers each have a high gain. The high gainof the differential amplifiers is selected to produce the increasedtrigger level voltage within the inverter. In one embodiment thepredetermined voltage is equal to or less than 0.1 volts below theprecharge voltage of VPC.

The improvement further comprises a circuit element for powering downthe dummy ROM memory core array in response to an inverted chip enablesignal, NCE, by driving the precharge signal PCOK to VDD. The elementfor powering down operates with zero power dissipation once the PCOKsignal is driven to VDD.

The invention is also an improvement in a method for generating aprecharge signal for a ROM memory core comprising the steps ofdischarging a delayed trigger signal in a dummy memory array simulativeof at least that portion of the main ROM core coupled to a single bitline; presetting the precharge signal, PCOK, to a logical zero;precharging the delayed trigger signal, DMYSECPC, toward a voltageprecharge signal, VPC, with a time delay simulative of the portion ofthe main ROM core; and triggering the PCOK signal high with a fast risetime when the delayed trigger signal, DMYSECPC, has reached apredetermined trigger level below the precharge signal VPC. As a result,the precharge signal PCOK is generated with a time delay simulative ofthe portion of the main ROM core with optimal tracking for processvariations, temperature and supply voltage variations.

The step of precharging the delay trigger signal, DMYSECPC, is at a ratedepending upon preprogramming of the dummy memory array.

The step of triggering PCOK signal high is comprised of the steps ofdriving two complementary CMOS differential amplifiers cascaded togetherin response to the delayed trigger signal, DMYSECPC, to generate anoutput from the cascaded pair of CMOS differential amplifiers andtriggering a CMOS inverter directly coupled to the differential pair ofCMOS differential amplifiers to generate the PCOK signal.

The step of triggering the cascaded CMOS differential amplifiers furthercomprises the step of selecting relative channel sizes of input FETs toeach of the differential amplifiers to set the point of triggering to apredetermined voltage below a precharge voltage VPC.

The step of triggering comprises the steps of increasing the triggerlevel of the CMOS inverter and setting the gain of the CMOS differentialamplifiers at a high level to match the increased level of the CMOSinverter and to trigger the CMOS inverter at a predetermined voltagebelow the precharge voltage VPC.

CMOS Trigger Circuit

The invention is an improvement in a trigger circuit for a read-onlymemory core for generating a trigger signal, TRIG. The read-only memorycore includes bit lines and dummy bit lines with memory cells coupled tothe bit lines and dummy bit lines. The improvement comprises a circuitfor detecting when a memory signal, DMY1, reaches a predeterminedvoltage difference from a logical zero voltage level defined by a memorysignal DMY0. The memory signals DMY1 and DMY0 are generated on thecorresponding dummy bit lines in the read-only memory core. Thecorresponding dummy bit lines are coupled to the memory cells which havebeen programmed to prevent DMY0 from discharging during a read cycle ofthe read-only memory core and to discharge DMY1 to a voltage levelapproximately 0.2 volt or less below a precharge voltage VPC. The DMY1signal defines a logical one voltage level. A circuit is provided forswitching the trigger signal, TRIG, to a logical one. The memory signal,DMY1, has PN junction leakage current and coupled noise voltages similarto one of the bit lines in the read-only memory core.

The circuit for detecting comprises a first CMOS differential amplifierand a second CMOS differential amplifier. The first and seconddifferential amplifiers are cascaded together. The first differentialCMOS amplifier is a complementary design to that of the second CMOSdifferential amplifier. Complementary design is defined as a circuitdesign adapted to allow each of the principal NFETs within one CMOSdifferential amplifier to be replaced with a PFET and vice-versa foreach corresponding circuit element within the first and second CMOSdifferential amplifiers without affecting operability of the design.

The first differential amplifier has outputs coupled directly to inputsof the second differential amplifier. The circuit for switchingcomprises a CMOS inverter. The CMOS inverter has inputs directly coupledto the outputs of the second CMOS differential amplifier. The first andsecond differential amplifiers have input trigger level voltages. Thetrigger level voltages are adapted for presetting at predeterminedlevels by varying channel sizes within input FETs within the first andsecond differential amplifiers.

The circuit for switching comprises a CMOS inverter. The CMOS inverterhas inputs directly coupled to the outputs of the second CMOSdifferential amplifier. The trigger level voltage of the first andsecond amplifiers is defined as having that magnitude which switches theoutput of the inverter to one-half of the supply voltage, VDD. Thetrigger level voltage is set at an increased value. The first and seconddifferential amplifiers each have a high gain. The high gain of thedifferential amplifiers are selected to produce the increased triggerlevel voltage within the inverter. The predetermined voltage is equal toor less than 0.1 volts below the logical zero voltage of DMY0 and infact may be as small as 50 mv.

The improvement further comprises a circuit for powering down thetrigger circuit in response to an inverted chip enable signal, NCEDELThe circuit also operates with zero power dissipation once the triggersignal, TRIG, is generated and until the end of a memory cycle. This isaccomplished by the signal Sense Latch Power Down (SLPD).

The invention is also characterized as an improvement in a method forgenerating a trigger signal, TRIG, comprising the steps of prechargingmemory signals, DMY1 and DMY0, toward a voltage precharge signal, VPC,with a time delay simulative the portion of the main ROM core coupled toa bit line. The trigger signal, TRIG, is preset to a logical zero. Apredetermined voltage difference is differentially detected between thememory signals, DMY1 and DMY0. The trigger signal, TRIG, is triggeredhigh with a fast rise time when the difference between the memorysignals, DMY1 and DMY0 has been differentially detected.

The step of differentially detecting is comprised of the steps ofdriving two complementary CMOS differential amplifiers cascaded togetherin response to the memory signals, DMY1 and DMY0, to generate an outputfrom the cascaded pair of CMOS differential amplifiers. The step oftriggering comprises the step of triggering a CMOS inverter directlycoupled to the differential pair of CMOS differential amplifiers togenerate the trigger signal, TRIG.

The step of differentially detecting in the cascaded CMOS differentialamplifiers further comprises the step of selecting relative channelsizes of input FETs to each of the differential amplifiers to set thepoint of triggering on the memory signal, DMY1, at a predeterminedvoltage below the memory signal, DMY0.

The step of triggering comprises the steps of increasing the triggerlevel of the CMOS inverter and setting the gain of the CMOS differentialamplifiers at a high level to match the increased level of the CMOSinverter and to trigger the CMOS inverter as a predetermined voltagebelow the memory signal, DMY0.

One-shot Pulse Generator for VLSI Memory Timing Control

The invention is an improved memory timing control circuit having aplurality of sequentially triggered precharged signals including PC0 andPC1. The circuit comprises in turn a circuit for defining a memoryprecharge time for the ROM core for fast process parameters, and acircuit for defining a precharge time sufficient to permit discharge ofan end of a previously selected word line.

The circuit for defining the precharge time sufficient to discharge theend of a previously selected word line comprises a single dummy wordline for generating a delay time for triggering the precharge signalswithin the memory. The dummy word line is coupled to the first one ofthe sequential timing signals PC0 thereby providing good performancewith the fast process parameters.

The circuit for defining the precharge time for fast process parameterscomprises coupling the output of the circuit for providing sufficienttime to discharge the end of the previously selected word line to thefirst one of the sequential timing signals PC0.

The improvement further comprises a circuit for deactivating the memorytiming control circuit so that zero power dissipation occurs when theoutput OWDN is high.

In the illustrated embodiment the single dummy line is comprised of aplurality of dummy line segments and further comprises a circuit forcharging each of the plurality of segments simultaneously and a circuitfor discharging the plurality of segments collectively as a seriescoupled delay line of the plurality of segments.

The circuit for serially discharging the segments of the dummy memorydischarges the last of the plurality of segments below a predeterminedthreshold trigger voltage. The timing signal OWDN is driven high by thecircuit for defining sufficient time to discharge the end of apreviously selected word line.

The invention is also an improvement in a method for generating adelayed precharging signal in a memory having word lines which areselectively discharged comprising the steps of precharging a dummy wordline high; presetting a timing control signal OWDN low; discharging thedummy word line low; and switching the timing control signal OWDN highwhen the dummy word line has been discharged low. The dummy word line isdischarged sufficiently to allow an end of the selected word line todischarge to ground. Thereafter a precharge clock signal, PC0, isterminated.

The step of terminating the precharge clock PC0 is the first one of aseries of sequentially trigger precharge clock signals including PC0 andPC1 which were used to precharge the read only memory.

The improvement further comprises the step of preventing powerdissipation in the memory timing control circuit after the timingcontrol signal OWDN is switched high.

RC Delay Circuit To Block Address Transition Detection

The invention is an improvement in a circuit for blocking spuriousaddress transition detections. A delay circuit, depicted in FIG. 19,delays an enable address transition detection blocking signal, ENSURG toproduce ENSURGD. An RC circuit varies the amount of delay added toENSURGD to generate a selectively timed address transition detectionblocking signal, SURG, with a selectively determined pulse width. Thecircuit timing is shown in FIG. 20.

The delay circuit comprises a plurality of logic gate delays having asan output the delayed enable address transition detection blockingsignal, ENSURGD. A logic gate for generating a selectively gated addresstransition blocking signal, NSURG, is also provided. The RC circuitcomprises a resistive element coupled to a capacitive element. A circuitis provided for precharging the resistive and capacitive elements.Another circuit is provided for discharging the resistive and capacitiveelements in response to the delayed enable address transition detectionblocking signal, ENSURGD. The resistive and capacitive elements arecoupled to the logic gate for generating NSURG. The logic gate isinhibited until discharge of the resistive and capacitive elements hasreached a predetermined trigger point after which the logic gategenerates the rising edge of the NSURG signal.

The RC circuit delays the falling edge of the SURG signal until afterthe occurrence of false address transition detection signals spuriouslycaused by noise.

The capacitive elements are adjustable through masking options to varythe pulse width of the address transition detection blocking signal,SURG.

The invention is also an improvement in a method for generating aselectively timed address transition detection blocking signal, SURG, inorder to disable address detection circuitry in a read-only memory fromfalsely triggering on noise caused by the switching of output drivers.The method comprises the steps of generating an address detectionblocking signal, SURG, when the output drivers are switched. The addresstransition detection blocking signal, SURG, is delayed by an enableaddress transition detection blocking signal, ENSURGD, through delaycircuitry. SURG disables the address detection circuits and is timed toblock false address detection signals caused by noise from the outputdrivers. This blocking signal, SURG, has a controlled pulse width suchthat process variations and voltage supply variations tend to cancel oneanother to produce a stable SURG pulse width across these variations.

The step of selectively delaying the enable address transition detectionblocking signal, ENSURGD, comprises the step of generating a delay witha gate delay circuit.

The step of selectively delaying ENSURGD comprises the step ofdischarging gate capacitance through the resistive FETs to generate adelayed gate control signal, and generating an address transitiondetection blocking signal SURG as controlled by the delayed gate controlsignal. The step of delaying ENSURGD matches the inherent delay of theoutput drivers. Both these delays are gate delays and so these delaysmatch for a wide range of operating and process conditions. In this waythe signal SURG may block spurious address transition detection signalsover a wide range of operating and process conditions.

The improvement further comprises the step of selectively varying thecapacitive and resistive portion of the gate delay circuit by maskoptions in order to vary the rising edge of the address transitiondetection block signal, SURG.

CMOS Sense Amplifier/Latch Circuit for a Single Data Input Signal

The invention is an improvement in the sense amplifier comprising adifferential amplifier having four inputs. Two of the four inputs arecoupled to an input signal, BIT. A third one of the four inputs iscoupled to a signal defining a logical one, DMY1. A fourth one of thefour inputs is coupled to a signal signifying a logical zero, DMY0. Thedifferential amplifier is arranged and configured to differentiallyamplify with high gain the BIT signal in reference to an effectivereference voltage defined between the voltage level of the DMY0 and DMY1signals. As a result of this combination of elements the sense amplifierhas a single data input relatively immune from noise. A latch circuit isprovided for latching the BIT signal at the output of the differentialamplifier.

The improvement further comprises a precharge circuit for prechargingthe differential amplifier outputs to an equalized voltage level tominimize response time to the inputs of the differential amplifier.

The improvement further comprises a noise isolation circuit forisolating the differential outputs of the differential amplifier fromthe inputs until such time as the inputs are substantially free ofnoise. The noise isolation circuit isolates the differential outputs ofthe differential amplifier from the inputs until the inputs have reachedpredetermined sensing levels.

The precharge circuit also isolates the outputs of the differentialamplifier from the inputs until the inputs are substantially free ofnoise. The precharge circuit isolates the outputs of the differentialamplifier from the inputs until the inputs have reached a predeterminedsensing level.

The inputs of the differential amplifier include field effecttransistors, each having a width-to-length ratio, and wherein the inputsof the field effect transistors coupled to the signal BIT havewidth-to-length ratio in combination greater than the inputs coupled tothe signals DMY0 and DMY1 to permit negative noise voltage on the BITsignal without imbalancing the differential amplifier.

The DMY1 input coupled to the input of the differential amplifier hassubstantially the same PN junction leakage current and coupled noisevoltages as the signal BIT coupled to a bit line within the read onlymemory.

The latch circuit latches the voltage level of the signal BIT within thedifferential amplifier when a predetermined voltage difference isdetected between the DMY1 and DMY0 signals.

The improvement further comprises a circuit for configuring the senseamplifier circuit in a condition of zero power dissipation after the BITsignal has been latched by the latch circuit without losing the value ofthe bit signal within the sense amplifier.

The invention can also be characterized as an improvement in a methodfor sensing a data signal, BIT, in a read only memory comprising thesteps of precharging the sense amplifier along with the precharge of theROM core data bit lines and virtual bit lines. The data bit signal, BIT,is sensed and latched within the sense amplifier.

The improvement further comprises the step of powering-down the senseamplifier after the step of latching to retain the data value of thedata signal, BIT, while consuming no power in the sense amplifier andwhile maintaining the data value of the signal, BIT.

In the step of precharging the sense amplifier, the outputs of the senseamplifier are precharged to a predetermined equalized voltage to permitfast response of the outputs in response to input signals later coupledto the sense amplifier during the step of sensing.

In the step of sensing at differential inputs to the sense amplifier,the signal BIT is sensed at two inputs on one side of a differentialamplifier within the sense amplifier, while the other side of thedifferential amplifier has an input coupled to a signal DMY0 and aninput coupled to a signal DMY1. The signal DMY0 is derived from a dummybit line within the read only memory wherein the dummy bit line isprogrammed within the memory to prevent discharging of the DMY0 during aread cycle. The DMY0 signal has a logical value of zero. The DMY1 signalis coupled to a dummy bit line and is programmed within the read onlymemory to discharge DMY1 to a voltage level defined as a logical onewithin the read-only memory.

In the step of sensing at the two inputs coupled to the single datasignal, BIT, sensing is at a lower conductance than the combination ofthe sensing at the inputs coupled to the DMY0 and DMY1 signals so thatnegative noise voltage on the data bit signal, BIT, does not imbalancethe inputs to the differential amplifier.

The improvement further comprises the step of isolating the inputs ofthe sense amplifier from the outputs of the sense amplifier after thestep of latching the data signal, BIT, in the sense amplifier so thatinputs to the sense amplifier may thereafter change while the latcheddata in the sense amplifier remains unchanged.

The two inputs coupled to the signals DMY0 and DMY1 provide a latchingthreshold voltage at a predetermined effective reference voltage betweenthe voltage of the DMY0 and DMY1 signals. The gain of the differentialamplifier is arranged and configured to amplify differences from theeffective reference voltage as small as 50 millivolts.

A Low Noise X Decoder Circuit for Use in a Semiconductor Memory

The invention is an improvement in an X decoder circuit in a very largescale semiconductor memory comprising a plurality of clocked devices inthe X decoder. Each of the devices having a dynamic node which issensitive to capacitive coupling. Noise on the dynamic node from thiscapacitive coupling may cause some FETs to turn on and load the clockseven when the devices are unselected. The plurality of devices arecoupled in parallel and small amounts of leakage from the devices may beof sufficient magnitude to affect the clock signals coupled thereto. Anoise clamping circuit is coupled to the dynamic node for dischargingthe dynamic node on all unselected devices for each read cycle of thememory.

The noise clamping circuit comprises a switching circuit for selectivelydischarging the dynamic node to ground on each read cycle throughcontrol of a precharge control signal, PCWD and a circuit formaintaining these discharged levels for the unselected devices.

The switching circuit comprises a plurality of devices for selectivelydischarging capacitively coupled noise from all unselected devices inthe X decoder to ground.

The X decoder comprises field effect transistors and the straycapacitance that exists between the source and gate of each of the fieldeffect transistors. The devices for discharging comprise a field effecttransistor coupled between the gates of the field effect transistorshaving the stray capacitance and ground. The field effect transistor fordischarging has a gate controlled by the control signal, PCWD. One ofthe FETs for discharging is provided for at least each of every four ofthe FETs having the stray capacitance in the X decoder.

The invention is also characterized as an improvement in a method ofsuppressing noise in an address decoder in a very large scale memoryhaving a multiplicity of devices with stray capacitance coupled to clocksignals. The multiplicity of devices are coupled in parallel to theclock signals. The dynamic node of each of the devices couples to theclock signals through the stray capacitance. The improvement comprisesthe steps of discharging the dynamic node to ground at the beginning ofeach memory read cycle to discharge the stray capacitance and the stepof clamping this node to ground for all unselected devices. The dynamicnode is unclamped from ground when selected and allowed to be drivenhigh. One of the decoder lines coupled to one of the dynamic nodes ischarged according to the memory address combination. The remainingdynamic nodes are clamped to logical zero voltage, even when each of theclock signals are coupled to the multiplicity of dynamic nodes. The stepof clamping is repeated on the next memory cycle of the memory toeliminate small but repeated charge accumulation through themultiplicity devices on the plurality of dynamic nodes.

The step of clamping comprises the step of shorting each of theplurality of dynamic nodes to ground through a field effect transistordriven by a precharge control signal, PCWD and the step of clampingthese nodes to ground for unselected devices.

Improved Time Constant Generation Circuit

The invention is an improvement in the method for generating a stabletiming signal using an integrated circuit RC timing delay element in asemiconductor memory comprising the steps of inputting an initialtrigger signal, OD, discharging the RC delay element to a predeterminedtrigger point, outputting a timing control signal delayed from theinitial trigger signal by the RC delay element after the trigger pointhas been reached so that temperature and process variations in thetiming control circuit and semiconductor memory tend to cancel supplyvoltage variations in the timing control circuit and in semiconductormemory to render the output timing control signal stable in the face ofvoltage supply, temperature and process variations.

The step of discharging the RC delay element is performed at a rate. Thechange of the rate of discharge varies inversely to the change ofcircuit speed of corresponding basic nodes within the timing controlcircuit as the basic integrated circuit device parameters and operatingconditions vary.

The change of the rate of the discharge of the RC element approximatelyequals the time change within the timing control circuits as the deviceparameters and operating conditions vary. The rates are algebraicallyadded to cancel variations in the two changes.

The invention is also an improvement in an apparatus for generating astable timing control signal comprising an input circuit for receiving atrigger signal, OD. An integrated circuit RC delay element is coupled tothe input circuit. The input circuit discharges the RC delay element.The RC delay element has an output. The output comprises a basic timingnode within the timing circuit. The input circuit discharges the RCdelay element so that as the voltage supply increases, the time delayalso increases. An output circuit generates an output signal when apredetermined trigger voltage is achieved at the basic timing node.

The input circuit further reduces the voltage supply range to the RCdelay circuit by the negative algebraic addition of at least one devicethreshold voltage within the timing circuit.

The trigger voltage is the voltage supply range on the basic timing nodereduced by the algebraic negative addition of at least two transistorthreshold voltages.

The input circuit varies the delay time on the basic timing node tooffset time varying components within the circuit to produce the stabletiming signal.

The input circuit offsets time varying components within the timingcircuit to substantially cancel time variations due to temperature,process and voltage supply variations. The timing circuit is an NMOScircuit or a CMOS circuit.

Memory Circuit Yield Generator and Timing Adjustor

The invention is an improvement in a semiconductor memory having a dummybit line, DMY1, simulating the worst case within the memory for readinga logical one comprising a circuit for providing a plurality ofselectable capacitors. A programmable circuit selectively couples atleast one of the capacitors to the dummy bit line DMY1 so that sensetime within the memory circuit is programmably varied. The dummy bitline, DMY1, is coupled to circuitry within the semiconductor memory todetermine sense time when memory cells within the memory will be read.

The programmable circuit comprises a plurality of field effecttransistors. One of the field effect transistors corresponds to each oneof the plurality of capacitors. The field effect transistors couple thecorresponding capacitor to the dummy bit line, DMY1. The field effecttransistors have a threshold voltage. The threshold voltage of eachfield effect transistor is programmably set to configure the fieldeffect transistor in either an ON or OFF condition.

In one embodiment the programmable circuit comprises a plurality oflinks. The links have a programmably determined conductivity. One of theprogrammable links is coupled to each one of the capacitors toselectively couple the corresponding capacitor to the dummy bit line,DMY1.

The improvement further comprises a plurality of precharge transistorsfor precharging the capacitors to a precharge voltage, VPC, prior tooperation of the memory.

The memory further comprises a second dummy bit line, DMY0, having anoperation similar to the worst case of a bit line with a logical zerocomprising a circuit for providing a plurality of selectable capacitors.A programmable circuit selectively couples the capacitors to the dummybit line DMY0 so that sense time within the memory circuit isprogrammably varied. The dummy bit line, DMY0, is coupled to circuitrywithin the semiconductor memory to determine sense time when memorycells within the memory will be read.

The invention is also an improvement in a memory circuit to adjust timeallotted to a memory cycle performed within the memory circuit relatingto bit line voltage drive coupled to a memory element within the memorycircuit in order to selectively allow user determined programmability ofread times of the memory circuit. The improvement comprises aprogrammable circuit for selectively generating a variable dummy bitline voltage drive. A trigger circuit is coupled to the programmablecircuit for determining when the bit line voltage drive reaches apredetermined trigger point to generate a trigger sense signal. A senseamplifier reads the memory element within the memory circuit in responseto the trigger signal from the trigger circuit. The sense amplifier iscoupled to the memory circuit and to the trigger circuit. As a result,critical timing functions of the memory circuit are programmablycontrolled by the user.

In one embodiment the programmable circuit comprises ROM core FETshaving a predetermined threshold voltage defined therein according tospecification of the user and a corresponding plurality of capacitiveelements coupled thereto. Selected capacitive elements are coupledthrough corresponding ROM core FETs to generate a delay time of the bitline voltage drive from the memory circuit coupled to the triggercircuit.

In another embodiment the programmable circuit comprises EPROM core FETshaving a predetermined threshold voltage defined therein according tospecification of the user and a corresponding plurality of capacitiveelements coupled thereto. Selected capacitive elements are coupledthrough corresponding EPROM core FETs to generate a delay time of thebit line voltage drive from the memory circuit coupled to the triggercircuit.

In still another embodiment the programmable circuit comprises randomaccess memory cells having a predetermined threshold voltage definedtherein according to specification of the user and a correspondingplurality of capacitive elements coupled thereto. Selected capacitiveelements are coupled through corresponding random access memory cells togenerate a delay time of the bit line voltage drive from the memorycircuit coupled to the trigger circuit.

In yet another embodiment the programmable circuit comprises read-onlymemory fuse links according to specification of the user and acorresponding plurality of capacitive elements coupled thereto. Selectedcapacitive elements are coupled through corresponding read-only memoryfuse links to generate a delay time of the bit line voltage drive fromthe memory circuit coupled to the trigger circuit.

Still further the programmable circuit comprises read-only memoryantifuse links according to specification of the user and acorresponding plurality of capacitive elements coupled thereto. Selectedcapacitive elements are coupled through corresponding read-only memoryantifuse links to generate a delay time of the bit line voltage drivefrom the memory circuit coupled to the trigger circuit.

The invention can better be visualized by now turning to the followingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a Y-precharge decoder used inconjunction with the memory core of FIG. 2.

FIG. 2 is a schematic diagram of a Y-bit decoder coupled to a memorycore.

FIG. 3 is a schematic diagram of a timing circuit for the generation ofPC2-SELV used in the memory core of FIG. 2.

FIG. 4 is a schematic diagram of the address transition detection latch.

FIG. 5a is a timing diagram of a latch shown in FIG. 4 where the latchresolves itself to the state where PASS is low and NSMPA is high.

FIG. 5b is a timing diagram similar to that of FIG. 5a, but shows themetastable state of the latch where it resolves itself to the oppositestate.

FIG. 6 is a block diagram of a prior art architecture for a read onlymemory.

FIG. 7 is a block diagram of the architecture of a read only memoryaccording to the invention.

FIG. 8 is a schematic diagram of a CMOS transfer gate used in themultiplexer shown in FIG. 7.

FIGS. 9A and 9B are a block diagram of the rightside sense amplifiers, acorresponding portion of the multiplexer and the output drivers as shownin FIG. 7.

FIGS. 10A and 10B are a block diagram of the leftside sense amplifiers,a corresponding portion of the multiplexer and some control circuitryused in the circuit of FIG. 7.

FIG. 11 is a schematic diagram of the circuitry used for the left-rightcontrol circuit, LRCNTL shown in the diagram of FIG. 10.

FIG. 12 is a schematic diagram of a timing control circuit of the priorart showing generation of a delayed precharged signal, PCOK.

FIG. 13 is a schematic of a CMOS differential cascaded amplifier circuitwhich is an improvement of the timing circuit of FIG. 12.

FIG. 14 is a dummy memory array used in combination with the timingcircuit of FIG. 13 to provide a programmable, simulative delayed triggercircuit for the generation of PCOK.

FIG. 15 is a schematic diagram of one embodiment of a trigger circuitsimilar that used in timing circuitry of FIG. 13.

FIG. 16 is a schematic diagram of another embodiment of the triggercircuit of FIG. 15 including an enhanced power down capability.

FIG. 17 is a schematic diagram of the one-shot pulse generator for VLSImemory timing control according to the invention.

FIG. 18 is a schematic diagram of a timing control circuit of the priorart including a one-shot pulse generator with the output, OWUP.

FIG. 19 is a schematic of the RC delay circuit of the invention forgenerating a delayed SURG circuit which compensates for process andvoltage supply variations.

FIG. 20 is a timing diagram of the operation of the circuitry of FIG.19.

FIG. 21 is a schematic diagram of the CMOS sense amplifier/latch circuitfor a single data input sisal according to the invention.

FIGS. 22A and 22B are a block diagram which illustrates the word lines,W0 through W31, decoded by decoders having the clock signals WSA-WSD,and PUMP as inputs.

FIG. 23 is a schematic of one of the word Line drivers in FIG. 22.

FIG. 24 is a schematic which shows a column select driver for the clocksPUMP, WSA, WSB, WSC or WSD in FIG. 22.

FIG. 25 is a time graph of the voltage at a signal or output node in aprior an timing circuit in a semiconductor memory.

FIG. 26 is a time graph of the voltage at a signal or output node in atiming circuit in a semiconductor memory according to the invention.

FIG. 27 is a prior art timing circuit.

FIG. 28 is a timing circuit operated according to the invention and iscompared to the operation of the prior an timing circuit of FIG. 27.

FIG. 29 is a timing diagram corresponding to the prior an circuit ofFIG. 27.

FIG. 30 is a timing diagram corresponding to the circuit of FIG. 28.

FIG. 31 is a schematic for a circuit for producing SURG as describedabove with the methodology of the timing diagram of FIG. 30.

FIG. 32 is a schematic of Y-delay generating circuit for programmablyinserting variable capacitances and, therefore, delays on selected nodeswithin the memory circuit.

FIG. 33 is an overall block diagram of a memory circuit utilizing theY-delay circuit of FIG. 32.

FIG. 34 is a voltage timing diagram illustrating the effect whenadditional capacitance is added to the dummy line DMY1.

FIG. 35 is a voltage timing diagram showing the effect when capacitanceis added to both the dummy lines, DMY1 and DMY0.

The invention and its various embodiments are described in more specificand illustrative detail below in the detailed description.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Memory Array Precharge

A very large scale, read-only memory, which is read by selectivelydischarging bit lines and virtual ground lines, is read at substantiallyhigher speeds by precharging the bit lines and virtual ground lines ofthe memory core at both the top and bottom of the memory core atopposing ends of the bit lines and virtual ground lines. The memory coreis precharged using a precharge decoder which provides upper and loweraddress precharging signals timed on sequential clocks. The prechargedecoder is selected to precharge sectors of the memory core by theaddress signals of the memory core. A precharge decoder is provided foreach sector of the memory core so that the entire memory core isprecharged in this manner.

A Latch Circuit Improvement to Minimize Metastability in Dynamic DigitalCircuits

Operation of an address latch circuit in a memory is conditioned onfirst receiving a ground surge control logic signal, SURG, which isgenerated only after the data output driven start switching. Thisprevents noise from these same drivers from falsely addressing thememory. Metastability is prevented by selecting the trigger points ofthe gates which make up the latch such that an output is not generateduntil input or intermediate circuitry has stabilized and by providing afavored output condition in the input or intermediate circuitry whenconflict between simultaneous inputs occur. Feedback of the output ofthe latch to its input further reduces metastability.

Details of Memory Array Precharge

An improved memory array precharge is depicted in the circuitry shown inschematic in FIGS. 1-3. FIG. 1 shows a Y-precharge decoder, YPREDEC;FIG. 2, a Y-bit decoder coupled to the memory core; and FIG. 3, a timingcircuit for the generation of PC2-SELV. Turn to FIG. 2 wherein theprecharging of the ROM core, generally denoted by reference numeral 10,is accomplished by a precharge circuit, generally denoted by referencenumeral 12, and controlled by clock signal, PC1. Precharge circuit 12 isillustrated in the schematic at find physically positioned on the chipat the top of ROM core 10. A bit line decoder, YDEC, generally denotedby reference numeral 14, is illustrated in the schematic of FIG. 2 andis physically positioned on the chip at the bottom of core 10. Bit linedecoder 14 is also controlled to precharge ROM core 10 as describedbelow.

Another difference between the circuitry of FIGS. 1-3 and that describedin connection with the parent application is the use of a 3-to-8 linepredecoder with a clocked input to each of the eight logic gates of thepredecoder as will be described in connection with FIG. 1. When theclock is high, all eight output lines are forced high. When the clock islow, three inputs are decoded to determine which one of the eightoutputs is to be high. Again, this is described in greater detail belowas well.

The improvement has the advantage that by precharging ROM core 10 with aprecharge clock PC1 at the top of core 10 and with a bit line decoder14, YDEC, at the bottom of core 10; the precharge time is significantlyreduced. For example, in the illustrated embodiment, the precharge timeis reduced by approximately 30 percent from that which was realized inthe parent application. The eight output lines of the 3-to-8 linepredecoder in FIG. 1 are clocked all high. With all the inputs to bitline decoder 14 in FIG. 2 high, the necessary precharge paths for ROMcore 10 are provided. When the clock, PC0, is low, three inputs to thepredecoder in FIG. 1 determine which one of the eight outputs is toremain high for sensing or reading core 10.

Consider first the Y predecoder circuit as depicted in FIG. 1. The eightYDLi outputs are generated by the 3-to-8 predecoder, generally denotedby reference numeral 15, shown in FIG. 1 in the right hand portion ofthe Figure with the exception that the clock, PC0, is an input to eachof the eight logic gates 16 which comprise predecoder 15. Each gate 16in turn is schematically comprised of a three-input AND gate 18 havingits output connected to one input of a NOR gate 20, whose output in turnis inverted by buffer 22.

The inputs to AND gate 18 of logic gates 16 are various ones of thelogical combinations of the address signals AA0N-AA2N as directlyprovided to predecoder 15 from other circuitry on the chip and as may beappropriately inverted by logic inverters 24 depicted in FIG. 1. Theother input to NOR gate 20 is the clock signal, PC0. When PC0 is high,the outputs of all the logic gates 16 YDLi are forced high. When PC0 islow, the three inputs AA0N-AA2N will be decoded and a selected one ofthe eight YDLi outputs will go high.

The predecoder 17 for the eight YDUi outputs for generating the upperaddress bits, are similarly provided by gates 16 depicted in the leftportion of FIG. 1. The same logical combination of the address inputsAA3N-AA5N are provided to the inputs of logic gates 16, as may beappropriately inverted, to provide the upper address outputs, YDUi. PC0again is coupled to the NOR gate component of each of the logic gates 16in predecoder 17 as just described. The field effect transistors (FETs)in the output inverters in logic gates 16 related to the YDUi outputs indecoder 17 are smaller than the corresponding FETs in decoder 15,because the load capacitance on those outputs is less than that for theYDLi outputs.

The YDLi and YDUi outputs are provided as shown in FIG. 2 to the bottomof the memory core 10. In the depiction of FIG. 2, only YDU0 and YDU1are shown as coupled to the YDUi decoder 28. However, it must beexpressly understood that there are three other similarly constitutedY-decoder circuits 28 coupled to three other similar portions of memorycore 10 in an identical fashion. These circuits have been omitted fromthe schematic for the purposes of clarity of explanation.

YDLi and YDU0 and YDU1, for example, are used in combination to selectone of eight bit lines in ROM core 10 for coupling the signal, BIT, tothe output line 26. The other three similar Y-decoder circuits likecircuit 28 utilizing the signal pairs YDU2/YDU3, YDU4/YDU5, andYDU6/YDU7 are used for each bit. The four circuits in combination allowfor the selection of one of 32 bit lines from ROM core 10 for each bitin the output data as will be described below.

Refer now briefly to ROM core 10. ROM core 10 has eight bit lines,30(0)-30(7). On each side of bits lines 30(0)-30(7) is a pair of virtualground lines 32(0)-32(8). Because virtual ground lines 32(0)-(8) havemore capacitance loading in ROM core 10 than do bits lines 30(0)-(7),the FETs 34(0)-(8) have greater channel widths than the select andprecharge FETs corresponding to the bit lines, namely FETs 36(0)-(7).The virtual ground lines 32(i) in ROM core 10 which are selected by theYDLi and YDUi signals are coupled to a clock signal, SELV, whichswitches between VPC, the high 0 logic signal, and ground, the low logic1 signal.

Turn for a moment to FIG. 3. The signal, SELV, is output from FETs 38and 40. FET 38 has a source coupled to VPC and its gate driven by PC0.The signal SEL, which is a control signal, indicates when the sensing ofmemory core 10 starts, and is coupled to the gate of FET 40. When SEL islow, memory core 10 is precharged by docks PC0 and PC1. SELV as shown inFIG. 3 is switched to VPC by PC0 during the precharge cycle while FET 40is off. SELV is driven to ground by SEL when ROM core 10 is read.

Consider now the overall operation of the circuit as described in FIGS.1-3. Circuit operation is divided into two phases. The first phase isaddress decoding and precharging of all the YDLi and YDUi lines high.The second phase is comprised of the step of selecting the bit lines30(i) and virtual ground lines 32(i) for sensing ROM core 10.

Consider now the first phase of address decoding. Near the beginning ofthe ROM cycle, precharge clocks PC0, PC1 and PC2 are the high from theend of the previous cycle or are switched high to precharge ROM core 10.The time duration of the precharge is controlled by conventionalcircuitry in the memory chip consistent with the present teachings. Theaddress is completed during the precharge phase in order to select: (1)the sector of ROM core 10 to be sensed; (2) the word line within thesector to be sensed; and (3) the bit lines of virtual ground lineswithin the sector which will be sensed. Bit lines 30(i) and virtualground lines 32(i) are selected by decoding the internal addressesAA0N-AA5N through the predecoder gates 15 and 17 described previously inconnection with FIG. 1.

One feature of the present improvement is the use of PC0 in theY-predecoder gates 15 and 17 of FIG. 1 to force each of the outputs YDLiand YDUi high when PC0 is high. This means that a precharge conductivepath will be coupled to each bit line and virtual ground line with SELV,which is held high during the precharge cycle. By this means, all 256bit lines and 256 virtual ground lines in ROM core 10 are simultaneouslyprecharged through the bottom of ROM core 10. However, precharge clockPC1 is high also during the precharge cycle. All the transistors 42gated by precharged clock PC1 also precharge the 256 bit lines and 256virtual ground lines to VPC during the precharge cycle from the top ofcore 10. By precharging ROM core 10 with PC1 from the top and throughdecoder 28 at the bottom, the precharge time is significantly reduced,for example by as much as 30 percent or more.

The second phase of the operation is in the selection of the bit linesor virtual ground lines for sensing or reading ROM core 10. Uponcompletion of ROM core precharging, PC0, PC1 and PC2 are sequentiallyswitched low beginning with PC0. After PC1 is switched low, the eightselected virtual ground lines are pulled low by the internal clock SELVoperating through decoder 28. The eight selected bit lines which areconnected from the Y-decoder circuits 28 to eight sensing circuitselsewhere in the memory chip discharge to the low logic 1 signal orremain at the high logic 0 signal depending upon how the eight selectedROM cells in core 10 are programmed.

Details of a Latch Circuit Improvement to Minimize Metastability inDynamic Digital Circuits

The copending parent application shows in connection with FIG. 35 anNMOS latch circuit using a multistate control scheme and edge triggeringtechniques. The improvement described here is specifically adapted toCMOS processing and utilizes a single latch state to avoid contentionwith other latches. The latch of the improvement is small andtransparent, but incorporates an input interlock scheme which providesgood monostability compatible with a circuit architecture that normallyis metastable. Thus, the trigger points of the latch and inverter, asdescribed below, are set to avoid metastability. The latch istransparent in the sense that is does not add time delays during thedetection of normal address transitions and signals are inhibited onlywhen a control signal is set high. The output of the latch is used todisable an input to the latch thereby providing feedback which furtherminimizes metastability.

The utility of the improved latch is particularly useful in dynamicdigital circuits and is not limited to read-only memory circuits. Thelatch is less likely to fall into a metastable state than prior artlatches which can cause a dynamic ROM, for example, not to accept anynew address transitions or to cause a dynamic ROM to output incorrectdata.

Turn to FIG. 4 wherein a schematic diagram of the improved latch isdepicted. The latch, generally denoted by reference numeral 42, iscomprised of NAND gates 44 and 46 which are cross-coupled to form alatching circuit combination to control the output sample addresssignal, SMPA. Latch 44 has as one input the address transition detectionsignal ATD and in its other input, the output of NAND gate 46. Theoutput of NAND gate 46 is designated as the signal, PASS, since itallows ATD to be passed through the latch. The inputs to NAND gate 46are the signals, SURG, PCOK and the output from NAND gate 44, which isthe logical inverse of SMPA and is denoted in the depiction of FIG. 4 asNSMPA. SMPA latches the new addresses into the address latches when itis high.

SURG is the signal which disables the address transition detectioncircuitry. When SURG is high, no address transitions will be accepted bythe read-only memory. Only when SURG is low will address transitions beaccepted and a new read cycle started. SURG is set high as the outputdrivers switch at the end of the read cycle. These output driversgenerate ground noise and the noise may be falsely detected as anaddress transition of the address transition detection circuitry is nototherwise disabled.

A third input to NAND gate 46 is the precharge signal, PCOK. PCOK is theoutput of NOR gate 48. PCOK is a precharge OK signal which switches highafter the ROM cell array is adequately precharged. PCOK is switched lowwhen SMPA switches high in order to disable the SURG input into thelatch until SURG is disabled by other circuits in the ROM. This iseffected by the feedback of SMPA from inverter 50 to NOR gate 48.Therefore, ATD will be passed on to cause latching of the new memoryaddresses as long as PCOK or SURG is low making PASS high.

The inputs to NOR gate 48 are the logical inverse of PCOK, NPCOK, andthe output of latch 42, SMPA. Thus, NOR gate 48 acts as an invertingdisabling gate so that latch 42 is disabled whenever SMPA or NPCOK is alogical high. When SMPA is a logical low, NOR gate 48 acts as aninverter, passing the input signal NPCOK to NAND gate 46. The output ofthe latch combination 44 and 46 is inverted by inverter 50 and presentedas the output signal SMPA.

PASS allows SMPA to be generated from the address transition. When PASSis low, SMPA is held low and a new read cycle cannot be started. WhenPASS is high, NAND gate 44 inverts ATD which is then reinverted byinverter 50 to provide SMPA. ATD, address transition detected, goes highwhen address transition occurs. The address will thus be latched when anaddress transition is detected as long as PASS is high.

Consider now the operation of latch circuit 42 shown in FIG. 5a. If theaddress transition detection circuit requests a new address cycle justas the previous address cycle is ending, then the possibility forcollision exists between the signals ATD and SURG. In the circuit ofFIG. 42, there will then arise a question of which of the signals PASSor NSMPA will go low first. A conflict of collision between ATD and SURGmust not result in a half-level of the output signal, SMPA.

The correct response in the event of a collision is:

(a) when SURG switches high, SMPA is inhibited until SURG switches low.After SURG switches low, SMPA is allowed to switch and to initiate a newcycle; and

(b) If SMPA switches high, a new read cycle is initiated and SURG from aprevious read cycle is not allowed to affect the new read cycle. A newread cycle will disable the SURG input to the latch.

Turn now to FIG. 5a. Assume that the address transition detected circuitrequested a new read cycle of the memory just as the previous read cycleis ending. A collision then occurs between ATD and SURG. This isillustrated in FIG. 5a wherein ATD is represented by line 52 and SURG byline 54 which are both rising beginning at the time T0 and T1 andreaching a high state at a later time.

The question arises then as to which NAND gate, gate 44 or 46, willswitch low first. The result in abstract is indeterminate and could goeither way depending upon uncontrolled parameters. To avoid errorsignals, a collision between ATD and SURG must not result in ahalf-level for the output signal SMPA. What is needed is that when SURGswitches high as shown in line 54 of FIG. 5a, that SMPA remainsinhibited as shown in line 60 until SURG again switches low.

Only after SURG switches low, will SMPA be allowed to switch high inorder to initiate a new read cycle in the memory. Further, after SMPAdoes switch high, and a new read cycle is initiated, SURG is not allowedthen to affect the new read cycle if it switches high at a later time.Starting a new read cycle must result in the SURG input to the latchbeing disabled. PCOK is held low by NPCOK until SURG is disabled byother circuits in the ROM. Address transitions must be permitted duringthe read cycle.

This is accomplished as follows. NAND 46 has a higher trigger point thaninverter 50 and NAND 44. The latch is able to resolve the metastablestate before switching inverter 50 and thereby effecting the output nodefor SMPA. Additionally, the trigger points of NAND gates 44 and 46 areunbalanced so that during the brief time of the metastable state, thevoltage of PASS is lower than NSMPA Therefore, as shown in FIG. 5a, whenbetween time T2 and T3 the metastable state occurs and NSMPA has ahigher value than PASS. This imbalance is important because the highervalue of NSMPA causes inverter 50 not to turn on as much. SMPA is thuskept at a low level so that other circuitry is not affected. Themetastable state between T2 and T3, therefore, never reaches a triggerpoint which is sufficient to trigger inverter 50 to cause significantchange from the low logic level of SMPA shown on line 60 of FIG. 5a.FIG. 5b shows the metastable state of the latch but in this case thelatch resolves itself to the opposite state. In this case SMPA is heldlow until the metastable state is resolved and then SMPA is allowed torise.

Further, NOR gate 48 has a low input trigger voltage. Input triggervoltages of NOR gate 48 and inverter 50 are determined by the ratio ofthe width of the P-channel and N-channel FETs. For example, increasingthe channel width of the NFET within the gate lowers the input triggervoltage. A relatively low amplitude of the SMPA pulse switches the PCOKnode, which is the output of NOR gate 48, low. This switching of PCOK toa low logic level prevents SURG from affecting the PASS node at theoutput of NAND gate 46. Thus, the second condition outlined above isachieved in that when SMPA switches high, PCOK switches low very quicklythereafter, thereby keeping PASS high notwithstanding what SURG does atthe input of NAND gate 46.

Data Multiplexing in Very Large Scale Integrated Memories with OptimumOperating Speed

A read only memory, divided into a left core and right core halves, isprovided with an improved read out architecture by proving separatesense amplifiers to each core haft in the immediate physical proximityof the bit lines of the core haft to reduce parasitic capacitance. Onlyone core portion is selected and read out through a multiplexer tooutput drivers. Power dissipation and noise generation which wouldnormally be created by precharging the entire memory core is therebyreduced by a factor of two. The rise and fall time of the senseamplifiers are adjusted to match the switching characteristics of theoutput drivers so that ground bounce and voltage source bounce aresubstantially reduced at the output of the memory.

Turn to FIG. 7 wherein an organization for a read-only memory in whichoperating speeds may be optimized is diagrammatically illustrated. Leftand right memory core portions or halves 62 and 64 are each directlycoupled on their bit line outputs to separate sense amplifiers 74 and76. Namely, eight sense amplifiers 74 to the left core memory 62 andeight sense amplifiers 76 to the right core memory 64. Each senseamplifier 74 and 76 includes an output predriver circuit. One address isused to multiplex the sixteen predriver outputs through multiplexer 82to driver circuits 80. The outputs of driver circuits 80 are coupled tooutput pads 72.

According to the invention, memory core 62 and 64 are divided in halfand only one half 62 or 64 is selected to read the memory. This resultsin one half the power dissipation in the memory core and reduction ofthe internal noise voltages caused by the read cycle and subsequent coreprecharge operations. Reduction of internal noise voltages increases thesignal-to-noise ratio at the bit line outputs, which in ram permitshigher operational speeds.

As diagrammatically depicted in FIG. 7, left and right memory cores 62and 64 have a total of sixteen lines which are geometrically distributedapproximately equally below the memory cores. Sixteen correspondingsense amplifiers 74 and 76 are geometrically positioned in the chipwhere the sixteen corresponding bit lines emerge from the Y decoder ofthe memory core (not shown). The ability to make a close geometriccoupling between the bit lines and their corresponding sense amplifiersprovides a design with minimum parasitic capacitance at the input of thesense amplifiers, which is a critical input node in a memory circuit.Reduction of parasitic capacitance allows for higher operational speedsin the memory.

As will be discussed below, the output of the predrivers in the senseamplifiers are provided with relatively long rise and fall times, namelyapproximately 25 nanoseconds. This prevents the large output FETs in thepredrivers from switching too quickly and thereby creating either asevere ground bounce or supply voltage, VDD, transient or bouncevoltage.

Since the output predriver nodes are relatively slow, multiplexingthrough multiplexer 82 is effectuated from these nodes to the eightoutput drivers 80. Because the predriver design is modified according tothe invention to compensate for multiplexing at the predriver nodes,there is no reduction in operating speed in the memory by virtue of thisdesign feature.

FIG. 8 diagrammatically depicts the basic CMOS transfer gate whichcomprises multiplexer 82 used for multiplexing the sense data outputsfrom the sense amplifiers 74 and 76 to the eight output drivers 80.Hereinafter, the reference numeral, 82, will be used interchangeably torefer to multiplexer 82 or to the transfer gates 82 which comprise it.The CMOS transfer gate is depicted in the schematic of FIG. 8 and iscomprised of an NFET 83 and PFET 85. The gate of NFET 83 is driven by anenabling signal, EN, while the gate of PFET 85 is driven by itscomplement, ENN. The input signals provided through an input terminal,IN, which is then gated through to the output terminal, OUT.

Output drivers 80 are shown schematically in the diagram of FIGS. 9A and9B as drivers 80(0)-(7). Each driver 80(i) in FIGS. 9A and 9B has twoinputs, one connected to a PFET and one connected to an NFET within thedriver (not shown). The two logic levels output by the driver, which arederived from the PFET and NFET in combination, are thus provided throughthe corresponding inputs NQiP or NQiN. By reference to FIGS. 9A and 9B,it may be noted that each driver 80(i) is coupled to four gates 82 ofthe type shown in FIG. 8. Two gates 82 are expressly shown in theschematic of FIGS. 9A and 9B and the remaining two, for generating NQiPor NQiN labeled in FIGS. 9A and 9B, are depicted in the schematic ofFIGS. 10A and 10B.

Logic control signals right byte, RBYTE, and left byte, LBYTE, shown onlines 84 and 86 in FIGS. 9A and 9B and on lines 88 and 90 in FIGS. 10Aand 10B are provided respectively to the transfer gates 82 in each ofthose figures to switch on transfer gates 82 to transfer NQiPL or NQiNLthrough gates 82 in FIGS. 10A and 10B to output drivers 80(i) and switchoff NQiNR and NQiPR through transfer gates 82 of FIG. 9, or visa versa.The left and right data bytes from core halves 62 and 64 are thusmultiplexed to output drivers 80.

FIG. 11 is a schematic diagram illustrating logic circuitry forgenerating some of the logic signals within the memory including LBYTEand RBYTE. This circuit is collectively referenced in FIGS. 10A and 10Bas left-right controller 98. In the case of LBYTE and RBYTE, thesecontrol signals are the inverted outputs of a latch 92 which is set bythe control signal left select, LSEL, or reset by the control signalright select, RSEL, provided by conventional control logic elsewhere inthe memory circuit.

FIG. 11 also receives the precharge signal from the memory cores 62 and64, PC0R and PC0L and combines them in a single precharge signal, PC0,through a NAND gate and inverter. PC0 is then provided to a Y prechargedecoder, YPREDEC 99 in FIG. 10 which decodes the address signals AA(i)Nto create upper and lower Y decoder control signals, YDL(i) and YDU(i),used to address the memory. Circuit 98 also produces a right and leftselect voltage, RSELV and LSELV, through inverters driven by RSEL andLSEL and precharged by PC0L and PC0R respectively. RSELV and LSELV areused in memory core selection. Delayed select signals PC2L and PC2R arealso generated from LSEL and RSEL respectively. These are used fortiming purposes in trigger circuit 96 in FIG. 10 and in sense amplifiers74 in FIGS. 9A and 9B and 10A and 10B.

NQiPL and NQiPR comprise sixteen signals on one hand, and NQiNL andNQiNR comprise sixteen signals on the other. Each of these signals arethe outputs of the predrivers in sense amplifiers 74 in FIGS. 9 and 10.In any one cycle, sixteen of these thirty two signals are multiplexed bymeans of transfer gates 82 to become eight NQiP signals or eight NQiNsignals, namely the left NQiN's and NQiP's or the right NQiN's andNQiP's. The NQiP and the NQiN are eight inputs to the PFETs or NFETsrespectively in the eight output driver circuits 80(i).

Consider now the operation of multiplexing circuitry. There are fourphases in the multiplex circuit. They are:

(1) precharging ROM core 62 and 64 and switching both the left select,LSEL, and right select, RSEL to zero;

(2) sensing the selected ROM core half 62 or 64 and latching the data;

(3) transferring the latch data byte to the eight output drivers 80(i);and

(4) maintaining the output data valid from the latch in the senseamplifier, SAMP, to the outputs of the drivers, 80(i) until the start ofthe new ROM cycle.

Consider now the phases in order. Beginning with precharging of ROM core62 and 64 and switching of the left and right select signals to zero, atthe beginning of the ROM cycle, the precharge clocks provided in thememory, PC0, PC1 and PC2, are high from the end of the previous cycle orthey have been switched high to precharge ROM core 62 and 64. The timeduration of the precharge is controlled by conventional logic circuitryin the memory through the means of a precharge okay signal, PCOK.

During ROM core precharge, the left select, LSEL, and the right select,RSEL, must be switched to zero because they are also used to control theprecharging and sensing of ROM core 62 and 64. At the beginning of theROM cycle, all the P sense amplifier outputs, NQiPL and NQiPR, areswitched and held high. All the N outputs, NQiNL and NQiNR, are switchedand held low. This switching and preconditioning is done by switchingoutput enable left, OEL, or output enable right, OER, to zero andholding both signals OEL and OER as zero until the data is latched. OELand OER are generated by an output control logic circuit 94, OUTCNTL,illustrated in FIG. 10 and described in greater detail below. By thismeans the eight output drivers 80(i) are disabled until the new data islatched.

The second phase of sensing the ROM core and latching the data beginwith the completion of ROM core precharging wherein PC0, PC1 and PC2 aresequentially switched low by convention memory circuits. Addressdecoding was completed during the precharge phase to select: (1) thesector of the ROM core 62 or 64 to be sensed; (2) the word line withinthe sector to be sensed; and (3) the bit virtual ground lines within theselected core sector which are to be active. The addressing protocolused in the memory again is conventional.

After the precharge signal PC1 is switched low, either the left select,LSEL, or right select, RSEL, signal is switched high to start thesensing of the selected left or right ROM core 62 or 64. The switchingof the left select signal, LSEL, or right select signal, RSEL, high willset or reset latch 92 shown in FIG. 11 resulting in either decodedcontrol signals, LBYTE or RBYTE as may be appropriate, switching orremaining high. The LBYTE and RBYTE signals then control the thirty twoCMOS transfer circuits 82 shown in FIGS. 9A and 9B and FIGS. 10A and 10Bto route the outputs of the selected left or right sample circuits 74 towhich they are connected as shown in FIGS. 9 and 10 to the outputdrivers 80(i) as shown in FIG. 9.

Now that the ROM core is sensed and the data latched in sense amplifiers74, the latched data must be transferred to the output drivers 80(i).The memory circuit has a trigger circuit 96 depicted in FIGS. 10A and10B which detects when the data from selected core portion 62 or 64 canbe latched by the sense amplifier circuits 74. When this occurs, anothercircuit, the output control circuit 94, outputs and drives either theoutput enable left, OEL, or output enable right, OER, signal high. Asshown in FIGS. 10A and 10B, the output enable left, OEL, controls theleftside sense amplifiers while the output enable right as shown inFIGS. 9A and 9B, controls the rightside sense amplifier 74. If theoutput enable left signal, OEL, switches high, the eight leftside senseamplifiers 74 shown in FIGS. 10A and 10B output their latched data tothe eight output drivers 80(i) via the transfer circuits 82. On theother hand, if the output enable right, OER, signal switch is high, theeight right side sense amplifiers 74 in FIGS. 9A and 9B output theirlatched data to the eight output drivers 80(i) via their correspondingCMOS transfer circuits 82. The data latched in the selected eight senseamplifier circuits 74 is now transmitted to the selected eight outputdrivers 80(i).

For the eight unselected sense amplifiers 74, the input to senseamplifier, OEX, remains low, and the sense amplifier output remains atthose levels which disable output drivers 80(i). These levels are nottransmitted to the output drivers since the transfer gates 82 areswitched off for the eight unselected sense circuits 74.

After the latched data is now transferred to the selected output drivers80(i), it must be held valid during precharge. As soon as the data islatched in sense circuit 74, a ROM core precharge cycle is started. Leftselect, LSEL and right select, RSEL, signals are switched to zero duringprecharge because they are also used to control the precharging andsensing of the ROM core 62 and 64. However, LBYTE and RBYTE remain validas established early in the ROM cycle. This requirement is met throughthe use of the latch circuit 92 shown in FIG. 11. The latch circuit isdiagrammatically shown in circuit block 98 in FIGS. 10A and 10B.Switching either left select, LSEL or right select, RSEL to zero doesnot affect the latch outputs of latch circuit 92 in FIG. 11 so thatLBYTE and RBYTE remain unchanged. The data latch in sense amplifiers 74is not affected by precharging and thus the output data remains validuntil the start of a new ROM read cycle.

A One Shot Pulse Generator for a Very Large Scale Integrated MemoryPrecharge Time Control

In a very large scale integrated memory core which is precharged by aprecharging signal, PCOK, improved timing for the generation of theprecharge signal, PCOK, is achieved through the use of a dummy memoryarray simulating at least that portion of the ROM core coupled to asingle bit line to generate a delay trigger signal, DMYSECPC. Thedelayed trigger signal DMYSECPC is coupled to the inputs of the pair ofCMOS differential amplifiers which are directly interconnected anddirectly coupled to a CMOS inverter from which the PCOK signal isderived. The delay time of the delay trigger signal, DMYSECPC, ismanipulated in part by programming the voltage thresholds of the memorycells in the dummy array. The trigger points in the circuit forgenerating PCOK are set by varying the channel widths of the input FETsto the CMOS differential amplifiers and adjusting the gains of the CMOSdifferential amplifiers to match the trigger point of the CMOS invertercoupled to it a cascaded output.

The invention as illustrated in FIGS. 13-14 is particularly designed foruse in a CMOS circuit. The pulse generator uses a small array of ROMcells to generate a dummy secondary precharge signal, DMYSECPC, with thedummy array sized to match a sector of ROM memory core coupled to onebit line. The precharge time for the dummy array and that required forthe ROM memory core:

(a) track process variations in the memory field effect transistor(hereinafter FET) threshold voltage in junction capacitance, diffusionresistance, etc.;

(b) track the temperature and internal supply voltage, VPC, used for theROM core; and

(c) is under program control so that it can be matched to the timerequired for precharging the ROM core.

The delay time from the start of the ROM cycle can be adjusted asdescribed below by programming the memory cells in the dummy memoryarray to provide an optimum precharge time for the ROM core. Theprecharge time varies more accurately than achieved by the prior artdevice in FIG. 12. This more accurate control is needed for a goodperformance in the face of process variations, temperature and supplyvoltage variations.

The precharge circuit, depicted schematically in FIG. 14, is used incombination with the dummy memory array 134 diagrammatically shown inFIG. 14. Turn first, however, to the schematic diagram of FIG. 13 whichshows the PCOK level detection circuit. The function of the circuitry ofFIG. 13 is to detect when the input, DMYSECPC, has risen, typically at arelatively slow rate, from 0 volts to about 0.3 volts below theprecharge voltage, VPC. This level is defined as the DMYSECPC triggerlevel. The circuitry of FIG. 13 is comprised of two cascadeddifferential amplifiers 100 and 102 each having two inputs. The outputof second amplifier 102 is twice inverted by a CMOS inverter comprisedof FETs 104 and 106 and then by NOR gate 108. The output of NOR gate 108is the precharge OK signal, PCOK.

A feature of the circuit of FIG. 13 is the use of a first amplifier witha current source to ground through FET 110 as controlled by theprecharge voltage, VRN2. The two outputs of amplifier 100 are connecteddirectly to second amplifier 102 which similarly has a current source toVDD through FET 112 as controlled by the signal VRP2. FET 110 is a NFETwhile FET 112 is a PFET and is so depicted in the Figure. Since thedesign is complementary, a device will simply be referenced as a FETwith the understanding that it may be an NFET or PFET depending on thedesign chosen.

The technique of cascading two complementary differential amplifiersallows the outputs of first amplifier 100 to be directly connected tothe inputs of the second amplifier 102 without voltage level shiftingcircuitry between them. Furthermore, it permits a direct connection ofthe output of second amplifier 102, the signal PREPCOK, to the gate ofFET 106.

The complementary differential amplifiers 100 and 102 are defined ascomplementary became the NFETs and PFETs are reversed from thecorresponding NFETs and PFETs in the other coupled differentialamplifier. For example, as shown in FIG. 13, the input FETs 114 and 116to differential amplifier 100 are NFETs, while the input FETs 118 and122 of second differential amplifier 102 are PFETs. Current source ofFET 110 in first amplifier 100 is an NFET while the correspondingcurrent source FET 112 in second amplifier 102 is a PFET and so forth ona device-for-device comparison between the two differential amplifiercircuits 100 and 102. The type could be reversed if desired, namely aPFET exchanged for every NFET and vice versa.

Another feature of the circuitry FIG. 13 is the use of a largerwidth-to-length ratio for the size of input FET 114 than for input FET116 and similarly for the device size of input FET 118 as compared toinput FET 120. When the input signal, DMYSECPC, is at the same voltagelevel as the input precharge signal, VPC, provided to the gate of inputFET 116, the imbalance between the FETs 114 and 116 on one hand andbetween FETs 118 and 120 on the other result in the amplifiers drivingthe output PCOK to a logical one. In the illustrated embodiment, thewidth-to-length ratio of input FET 114 is 12/1.5 as compared to 5/1.5for FET 116 and similarly for FET 118, it is 10/1.5 as compared to 5/1.5for FET 120.

The magnitude of the imbalance in the width-to-length ratio determinesthe differential voltage below the precharge voltage signal, VPC, thetrigger signal, at which DMYSECPC causes the PCOK output to switch to alogical zero. Increasing the width-to-length ratio, W/L, of input FET114 and/or input FET 118 reduces the voltage level or trigger levelrequired for DMYSECPC to switch the PCOK signal from the logical zero tological one. In the preferred embodiment, FETs 114 and 118 have agreater channel width than those of the corresponding FETs 116 and 120.However, a shorter channel length may be preferred in some applications.

The trigger level of the input signal, DMYSECPC, can also be shifted bychanging the width-to-length ratio of the NFET 106 or the PFET 104 inthe CMOS inverter connected to the output, PREPCOK, of the seconddifferential amplifier 102. The input trigger level is defined as thatinput voltage which switches the specified output voltage to one-half ofthe supply voltage VDD. The CMOS inverter can have NFET and PFET channelsizes chosen to set the input trigger voltage of the inverter low, whichdecreases the trigger level of DMYSECPC, or set high which wouldincrease the trigger level of DMYSECPC.

Consider now the dummy memory array circuit of FIG. 14. The dummy arraycircuit is a small array of ROM cells along with control logic 164-178to rapidly discharge the internal nodes of the array and control logic146, 148, 182, 186, 188 to allow the nodes in the array to precharge ina manner which emulates the precharge of the main ROM memory core. Thearray is sized and structured to match a sector of the ROM core which iscoupled to one bit line in the main core.

Referring now specifically to FIG. 14, the nodes coupled to the signalsVG2, DPC1, DPC2, DMYSECPC, VG1 and DPC3 are each memory diffusion lineswhich connect to the source or drains of the five rows of memory FETs orcells 134 in the dummy array. Consider for example five columns on theright end of dummy array 134 which are labeled by the reference numerals136-144. In array 134, cells 146, 148, 150, 152 and so forth shown inthe Figure as blank cells are low threshold voltage memory FETs, whilethe cells which are filled with an X throughout the array, are highthreshold voltage memory FETs. The number of memory FETs connected todiffusion line 128 carrying DMYSECPC is the same as the number connectedto a single sector bit line in the main ROM core. The purpose for thisis to match the capacitance loading and diffusion resistance in thedummy array 134 with the corresponding core sector.

The memory cells in column 136-144 and in rows 154-162 are also in theprecharge path in the main memory core. These cells comprise thesubarray of cells 186 within the dotted line block and are programmed ashigh or low threshold voltage cells to change the charging current toDMYSECPC. By this means, the precharge time of the node or diffusionline 128 carrying DMYSECPC can be programmed to be less than or greaterthan the precharge time of the main memory core.

The general organization of the PCOK circuit of FIG. 13 and the dummyarray circuit of FIG. 14 now having been described, consider theoperation of the PCOK circuit. The PCOK circuit of FIG. 13 operates infour phases which are comprised of the steps of:

(a) discharging the DMYSECPC signal and presetting PCOK low;

(b) precharging DMYSECPC toward the precharge voltage VPC;

(c) triggering the PCOK circuit to switch the output high; and

(d) powering down the PCOK signal if the control signal not chip enable,NCE, is switched high.

Consider first the step of discharging the DMYSECPC signal andpresetting PCOK low. At the beginning of the memory cycle in the mainROM, the sample address signal, SMPA, strobes high. In FIG. 14, the FETs164-178 are gated by SMPA and discharge lines 122-132 and the nodescoupled to lines 122-132 to zero. Memory FETs are used for gates 146 and148 because they match part of the precharge path which also is providedin the main ROM core sector. The output of inverter 180 is driven low bySMPA to switch off FETs 182, 184, 146 and 148. This opens all paths tothe supply voltage VDD and allows the internal array nodes discharge tozero volts before SMPA switches low.

Referring now to the PCOK circuit of FIG. 13, SMPA turns on FETs 186,188 and 190. FETs 186-190 unbalance the internal nodes of the PCOKcircuit to preset the output PCOK signal to a logical zero. Also, SMPAdrives one input of NOR gate 108 to quickly switch PCOK to zero whileSMPA is still high. PCOK remains low until DMYSECPC precharges to thetrigger level voltage. PCOK then switches high.

DMYSECPC lines now having been discharged and PCOK having been presetlow, DMYSECPC is precharged towards the precharge voltage VPC. When SMPAswitches low, the output of inverter 180 in FIG. 14 switches high andFETs 182, 184, 146 and 148 begin to precharge the array nodes coupled todiffusion lines 122, 130, and 126 respectively. The memory cells incolumns 136-144 and rows 154-162 in the subarray 186 that are programmedwith a low threshold voltage will provide a charging current to theDMYSECPC array nodes. The memory cells having a low threshold voltagemay exceed the number of those used in the ROM core sector becauseDMYSECPC has more interconnection and gate load capacitance in the dummyarray than exists on the corresponding nodes in the main ROM coresector.

The precharging of DMYSECPC towards the precharge voltage VPC now havingbeen initiated, consider the step of triggering the PCOK to switch thePCOK output high. Refer again to FIG. 13 and note that DMYSECPC and VPCare connected to input FET 114 and to FETs 116 and 192 respectively. AsDMYSECPC precharges toward the trigger level voltage, the output ofsecond differential amplifier 102, PREPCOK, increases from 0 volts. WhenPREPCOK has a voltage level greater than the switching voltage of FET106, the output node NPCOK begins switch toward ground. When PREPCOK hasa voltage level equal to that of the trigger voltage of the CMOSinverter 104 and 106, PCOK will then switch quickly to a logical one.

The PCOK output signal is thus characterized by a very fast rise time toa logical one when DMYSECPC reaches the proper trigger voltage belowVPC. This is due to:

(1) the high gain of differential amplifiers 101 and 102; and

(2) the threshold effect caused by inverter 104/106.

The PCOK output does not switch high until PREPCOK has increased fromzero volts to the trigger level voltage of the inverter 104/106. In theillustrated embodiment, the differential input trigger level to causethe PCOK output to switch high is about 0.3 volts below VPC.

Having now considered the triggering of the PCOK signal high, considerthe power-down of the circuit if the inverter chip enable signal, NCE,is switched high. When NCE is high, FETs 194 and 196 are turned off.NPCOK is switched to ground by FET 198 which is gated by NCE. NPCOK andSMPA are low and PCOK is driven high by NOR gate 108. There are nocurrent paths from VDD to ground so that the power dissipation in PCOKcircuit shown in FIG. 13 is zero.

CMOS Trigger Circuit

In a read-only memory core improved generation of a trigger signal,TRIG, is achieved through the use of a pair of cascaded CMOSdifferential amplifiers which are directly interconnected and directlycoupled to a CMOS inverter from which the trigger signal, TRIG, isderived. The cascaded differential amplifiers have trigger points set byvarying the channel widths of the input FETs to the CMOS differentialamplifiers, or by adjusting the gains of the CMOS differentialamplifiers to match the trigger point of the CMOS inverter coupled toits output. The trigger circuit is powered down to zero powerdissipation whenever it is inactive.

FIG. 15 is a schematic very similar to the trigger circuit of FIG. 13with the exception that certain of the transistors in FIG. 13 are notneeded for the trigger circuits shown in FIGS. 15 and 16, and to furthershow that certain input signals differ between the particularapplication of the trigger circuit 16 and the trigger circuit shown inFIG. 15. The trigger circuit shown in FIG. 15 is used for an applicationrequiring only one trigger circuit for the ROM. The trigger circuitshown in FIG. 16 is one of two circuits used in an application, likeshown in FIG. 7, where a left trigger circuit and a right triggercircuit (not shown) are used. However, to the extent that the devicesare closely analogous both in structure and in input signals, the samereference numerals are used in common between FIGS. 13 and 16. Thetrigger circuit of FIG. 15 will be described only to the extent that itdiffers from the description previously provided in connection with FIG.13.

The trigger figure circuit of FIG. 15, as well as the one shown in theparticular application of FIG. 16, is comprised of two cascadeddifferential amplifiers 100 and 102 each having two inputs. The outputof second amplifier 102 is twice inverted, once by CMOS inverter 104,106 and secondly by an inverter 200 to form the output signal trigger,TRIG.

As described above, the trigger circuit of FIGS. 15 and 16 uses thefirst differential amplifier 100 with a current source to ground throughtransistor 110 as gated by VRN, an internal reference voltage for thedifferential amplifier. The two outputs of first amplifier 100 aredirectly connected to the second amplifier which has a current sourcecoupled to VDD through transistor 110 gated by VRP, another internalreference voltage for the differential amplifier circuit. Twocomplementary differential amplifiers are, therefore, cascaded by directconnection without level shifting circuitry between them. There is alsoa direct connection to the output of the amplifier, signal PRETRIG, tothe gate of transistor 106 of the CMOS inverter.

Another important feature as previously described and shown in FIG. 15is the use of different ratios for input transistors 114 and 116 offirst amplifier 100. When input signal DMY1 to transistor 114 is at thesame voltage level as the input signal DMY0 to transistor 116, theunbalance in the FETs 114 and 116 results in the amplifiers 100 and 102driving the output TRIG to logical zero. DMY0 is a dummy bit line in aROM core with ROM cells programmed to prevent DMY0 from dischargingduring a read cycle. DMY0 is precharged to the precharge voltage VPC. Ithas a capacitive load and coupled noise voltage similar to that of thebit line and the DMY1 line. DMY0 is used as the logical zero referencevoltage for the eight sense amplifiers and for the sense trigger circuitas shown in FIG. 15. Similarly, the signal DMY1 is identical to DMY0except that the ROM cells on DMY1 are programmed to discharge DMY1 to avoltage level about 0.2 volts below the precharge voltage VPC and isused to define the logical one. DMY1 is a logical one reference voltagefor the eight sense amplifiers in the trigger circuit.

The magnitude of the imbalance in the width-to-length ratio in the FETinput transistors 114 and 116 determines the differential voltage belowDMY0 at which DMY1 will cause the TRIG output to switch to a logicalone. Increasing the width-to-length ratio of input transistor 114reduces the voltage level required for DMY1 to switch the TRIG output toa logical one.

In the illustrated embodiment, FET 114 has a slightly greater channelwidth than that of FET 116. However, a slighfiy greater channel lengthfor FET 116 may be preferred in some applications. The logical one levelof DMY1 can also be shifted by changing the width-to-length ratio ofNFET 106 and PFET 104 in the CMOS inverter which has PRETRIG as input.The CMOS inverter can have the NFET and PFET width-to-length sizeschosen to set the input trigger voltage of the inverter low, whichincreases the logical one level of DMY1 or high which reduces thelogical one level. As before, the input trigger level is defined as theinput voltage which switches the output voltage of the inverter 104, 106to one half of VDD.

The operation of the trigger circuit of FIG. 15 comprises three steps:

(a) Precharging the ROM core DMY0 and DMY1;

(b) sensing the ROM core to discharge DMY1 for generating a TRIG outputsignal; and

(c) powering-down the TRIG circuit.

Consider first the operation of precharging the ROM core DMY0 and DMY1.Near the beginning of the ROM cycle, the precharge clocks PC0, PC1 andPC2 are either high from the end of the previous cycle or they areswitched high to precharge the ROM. The time duration of the prechargeis controlled by a ROM circuit, which is called PCOK, and is previouslydescribed in connection with FIG. 13. Clock PC2 precharges DMY0, DMY1and the eight bit lines to the precharge voltage VPC. The transistors202, 204, 206 and 208 in FIG. 15 are turned on by the PC2 clock Thesefour FETs unbalance the internal nodes of the TRIG circuit of FIG. 15 topreset the TRIG output signal to a logical zero. The node 210, NDM0, ispreset high, the signal PRETRIG is preset low and its inverse NTRIG ishigh.

The ROM core is then sensed and the TRIG signal is then generated asfollows. Upon completion of the ROM core precharging, the clocks PC0,PC1 and PC2 are sequentially switched low respectively. Address decodingis completed during the precharge phase to select:

(1) the sector of the ROM core to be sensed;

(2) the word line within the sector; and

(3) the bit and virtual ground lines within the sector.

After PC1 is switched low, eight selected virtual ground lines in thememory and the virtual ground line for DMY1 are switched low by aninternal ROM clock SELV. DMY1 then starts discharging relatively slowlytoward ground while DMY0 remains at about the voltage precharge level,VPC. As DMY1 ramps down node 210, NDM0, also ramps down and signalPRETRIG increases from 0 volts. When PRETRIG has a voltage level greaterthan a threshold level of FET 106, NTRIG begins switching toward ground.When PRETRIG has a voltage level equal to the input trigger of the CMOSinverter 104, 106, the output signal TRIG switches relatively quickly toa logical one.

The TRIG output signal has a very fast rise time to a logical one whenDMY1 reaches a proper trigger voltage below DMY0. This is due to:

(1) the high gain of the differential amplifiers 100 and 102; and

(2) the threshold effect caused by the CMOS inverter 104, 106.

The output TRIG does not switch high until the signal PRETRIG hasincreased from 0 volts to approximately the trigger level of the CMOSinverter 104, 106. In the present invention, the differential inputtrigger level is about 0.15 volts below DMY0.

The powering-down of the trigger circuit is performed as follows. First,the inverted chip enable delayed signal, NCEDEL, is high therebyswitching off PFET 194 and 196. PRETRIG is switched to ground by NFET212 gated by NCEDEL With PRETRIG low, NFET 106 is also switched to offand there is no current path from VDD to ground so that powerdissipation is zero.

Second, in another embodiment of the invention as shown in FIG. 16,there is an automatic power-down when NCEDEL is low. A signal SLPD isprovided which is low during precharge, sensing and generation of theTRIG output signal and thereafter switches high. As will be shown, thehigh level reduces power dissipation in the TRIG circuit of FIG. 16 tozero. When SLPD switches high, PFETs 214 and 216 are switched off. Theprecharge clock PC2 then switches high. PRETRIG is driven low by PC2through PET 206 as previously described. With PC2 and SLPD high, thereis no current path from VDD to ground so the power dissipation is zerofor the remainder of the memory circle cycle.

One-shot Pulse Generator for VLSI Memory Timing Control

An improved precharge timing control is provided for triggering thefirst one of a series of precharge clocks PC0 by means of discharging asingle dummy word line. The dummy word line is comprised of a pluralityof dummy word line segments wherein each of the segments are charged inparallel, but discharged in series. The discharge time required of theplurality of word line segments is sufficient to allow discharge of anend of a selected word line in the read only memory to ground. Improvedtiming with good performance is achieved by triggering the earliestprecharge clock PC0 among a series of precharge clocks PC0 and PC1, forexample, so that an improved precharge time for the ROM core for a fastprocess parameter is realized.

The time delay from the start of a ROM cycle to the time when the firstof the precharge signals, PC0, is switch low, must provide: (a)sufficient precharge time for the ROM core; and (b) sufficient time todischarge the end of the previously selected word line to ground. Usinga dummy word line to control PC0 instead of PC1 as was the case in thecopending parent application, provides improved precharging as neededfor good performance with fast process parameters. Delaying PC0automatically delays PC1 since the ROM is designed to require PC0 toswitch low first.

For slow process parameters, the PCOK circuit of FIG. 13 in the ROM isneeded to provide sufficient time for precharging the ROM core. Byutilizing both the circuitry of FIG. 17 and the PCOK circuitry of FIGS.13 and 14 to delay PC0 from switching low, the delay time requirementsfor both precharging the ROM core and discharging the end of thepreviously selected word line to ground are both met for all processparameter variations.

Using one dummy word line instead of two reduces the silicon die arearequired for the circuit and allows for higher density circuitry as wellas ease of design. Therefore, what is described in connection with FIG.17 is a timing circuit particularly adapted for CMOS processing whichuses a single dummy word line instead of two, which offers zero powerdissipation when the output is either high or low, and which controlsthe time to switch PC0 low instead of the PC1 precharge clock as was theprior practice.

Turn now to FIG. 17 which shows the improved one-shot pulse generatorused for VLSI memory timing control. The propagation delay time of apulse applied to one end of a word line is due to the distributedresistance and capacitance of the polysilicon word line connected to therow of ROM cells across the ROM core. The purpose of the circuit in FIG.17 is to provide a delay time which is about the same as that requiredto discharge the end of the previously selected word line, hereinaftercalled the old word line, at a relatively slow rate to 0 volts. Thesensing of the ROM core array of cells must be delayed until the oldword line is down or low enough to prevent sensing old data instead ofnew data.

The old word line down (OWDN) circuit of FIG. 17 is comprised of sixinverters, seven PFETs and one dummy word line folded into sevensegments. Each word line segment is one eighth the length of the wordline in the ROM core. The number of segments can be increased ordecreased according to the amount of delay needed. In the illustratedembodiment, only seven segments were required.

The output of an inverter 218 is connected to the beginning of a dummyword line 220. The seven dummy word line segments 220-232 are connectedin series to achieve a relatively long delay line for the discharge toground. This delay simulates a discharge time of the old word line inthe ROM core. The end of the dummy word line is connected to the inputof inverter 234. The three inverters 234, 236 and 238 are cascaded toprovide a high voltage gain from the input of inverter 234 through theoutput of inverter 238. This significantly increases thedelay-time-to-rise time ratio of the output signal, old word down, OWDN.The delay time is measured from the falling or trig edge of the sampleaddress signal, SMPA, which is provided as an input to inverter 240whose output in turn is coupled to inverter 218.

The purpose of folding the dummy word line into seven segments 220-232is to allow FETs 242-248 and inverter 218 to rapidly precharge the fulllength of the dummy word line. Clearly, a different number of segmentscould be used be desired. In the presently illustrated embodiment, theprecharge time is about 16 times less than the discharge time of thedummy word line collectively comprised of segments 220-232.

The general structure of the old-word-down circuit of FIG. 17 now havingbeen described, consider its operation. The operation is comprised ofthe steps of:

(1) precharging the dummy word line high and presetting the old worddown signal OWDN low;

(2) discharging the dummy word line toward ground; and

(3) switching the old word down signal, OWDN, output high.

OWDN is low during precharge and switches high. The high level switchesPC0 to zero if PCOK is high. If OWDN is high at the start of a ROMcycle, it is switched to zero when SMPA switches high.

Consider the first step of precharging the dummy word line high andpresetting OWDN low. At the beginning of the ROM cycle, the sampleaddress signal, SMPA, strobes high. In FIG. 17, inverters 240 and 250are gated by SMPA. The output of inverter 240 is coupled to the gates ofPFETs 242-248 which discharge them to 0 along with the input of inverter218. By this means, both ends of each of the seven dummy word linesegments 220-232 are quickly precharged to VDD. The output of inverter234 is driven low by PFET 248 precharging the input of inverter 234.Inverter 234 drives OWDN low by means of the cascaded inverters 236 and238.

OWDN now having been set low and the dummy word line segments set high,consider the step of discharging the dummy word line. When SMPA switcheslow, the outputs of inverters 240 and 250 switch high thereby turningoff PFETs 242-248. Inverter 240 drives the output of inverter 218 lowwhich starts the discharge of the beginning segment 222 of word linesegments 220-232. Since the seven segments are connected in series, thesegments are discharged sequentially to provide a relatively long delaytime.

Finally, consider the step of switching the output OWDN high. When theend of dummy word line 220-232, in particular segment 232, discharges tothe input trigger threshold voltage of inverter 234, the OWDN signal isquickly switched from ground to VDD by means of cascaded inverters 236and 238. Input trigger level is again defined as the input voltage whichwill switch the specified output voltage to one half of the supplyvoltage, VDD.

RC Delay Circuit To Block Address Transition Detection

Improved delay and control of the pulse width of an address transitiondetection blocking signal, SURG, is achieved by providing an integratedRC circuit used to vary a control gate signal to determine the width ofthe address transition detection block signal, SURG. SURG is applied tothe address transition detection circuitry to protect that addresstransition detection circuitry when output drivers are switched at theend of a read cycle. The beginning of the address transition detectionblock signal, SURG, is triggered on a logic gate delay signal, whilepulse width of the SURG signal is determined by the RC integratedcircuit, whose capacitive portion is quickly precharged and thendischarged in response to the delayed signal.

FIG. 19 is a schematic showing an improvement in an RC delay circuit toblock address transition detections. A plurality of transistors,collectively denoted by reference numeral 252, form an N+ resistor.Transistors 254-260 are a plurality of FETs which act as gate capacitorswhich can be selectively added or subtracted from the N+ resistor 252.Inverters 262 and 264 amplify the RC delay signal. Inverter 266discharges or precharges the N+ resistor 252 and gate capacitors254-260. PFET 268 quickly precharges the RC delay circuit. Inverters270, 272, 274 and 276 are used to delay the rising edge of the outputsignal, enable surge delay, ENSURGD.

The basic structure of the circuitry of FIG. 19 having now beenoutlined, consider its operation. N+ resistor 252 is precharged high atthe start of a memory read cycle and is discharged at the end of a readcycle. N+ resistor 252 and gate capacitors 254-260 form an RC delaycircuit. When the signal ENSURGD goes low at the start of a new readcycle, the PFET in inverter 266 precharges N+ resistor 252 and gatecapacitors 254-260. PFET Q1 is added to precharge N+ resistor 252 andgate capacitors 254-260 at a higher rate.

When ENSURGD goes high at the end of the read cycle, the RC delaycircuit is discharged. The discharge of this RC delay circuit plus somegate delay determines the width of the output pulse, SURG.

SURG disables the address transition detection circuitry. When SURG ishigh, no address transitions will be accepted by the read only memory.When SURG is low, address transitions are accepted and a new read cyclecan be started. SURG is set high as the output drivers switch at the endof the read cycle. These output drivers generate ground noise and thisnoise may be falsely detected as an address detection if the addresstransition detection circuitry is not otherwise disabled.

If the operating voltage of the circuit, VDD, increases for any reason,the RC delay increases, but the gate delay decreases. This balance of RCand gate delays produces a pulse width that does not substantially varyas a function of combined process and operating voltage variations ordrift.

The rising edge of ENSURGD is delayed by inverters 270-276 so that therising edge of the SURG pulse which is output from NAND gate 278 andinverter 280 disables the address detection circuitry elsewhere in thememory circuit just before noise from the output driven can generate afalse sample address pulse, SMPA. The input to NAND 278 in turn is theoutput of inverter 276, ENSURGD, and the output of inverter 264, NOSS.

Reference to the timing diagram of FIG. 20 will illustrate the pointmore clearly. Line 282 of FIG. 20 represents an output signal while line284 represents the ground voltage. A change of output signal at time 286can cause some noise on ground line 284 during a later time interval288. The noise during interval 288 in turn can cause a false addresstransition detection as depicted on the address transition detectionsignal 290 at time 292. When ENSURGD as shown on line 294 goes active tothe input of inverter 266, at an RC time delay later as depicted byinterval 296, the output of inverter 264, NOSS, transitions low at time298, thereby causing SURG as depicted on line 302 to go low at edge 304.

When the SURG pulse is high, the address input receivers are disabled.This time is added to the read cycle, so it is very desirable tominimize it. Metal cut and open options 255, 257, 259, and 261 are addedto the RC delay circuit to adjust the SURG pulse width to be as small aspossible consistent with the present teachings. Additionally, metal cutand open options vary the delay from the rising edge of ENSURG to therising edge of SURG. These metal cut and open options can accuratelyposition the rising edge of SURG. By changing the metal mask, the SURGpulse width and the position of its rising edge may be easily varied.

CMOS Sense Amplifier/Latch Circuit for a Single Data Input Signal

A sense amplifier for use in a read-only memory circuit for sensing thedata bits having improved latching and sensing capabilities is providedthrough the use of a four input differential amplifier. Two of theinputs are coupled to the data bit signal, BIT, while the other twoinputs are coupled to dummy bit lines, DMY0 and DMY1. The conductance ofthe input FETs coupled to the data bit signal can be less than theinputs coupled to the dummy bit lines if greater negative noise voltageneeds to be tolerated at some sacrifice in the switching speed of thesense amplifier. Further, the differential amplifier has its outputsisolated from the inputs during a precharge period until such time asafter the inputs become less noisy. Still further, the outputs of thesense amplifier are precharged to an equalized voltage to allow for aquicker response once the inputs are coupled through the differentialamplifier to the outputs. Data is latched into the differentialamplifier after it is reliably sensed and the outputs again disconnectedfrom the inputs so that the inputs may then change in response to thenext read cycle without affecting the latched data outputs. After thedata is sensed and latched, the sense amplifier is then powered-down sothat no power is consumed in the circuit.

The CMOS differential amplifier of the invention utilizes two inputs, acurrent source and a current mirror. Only one of the inputs is a datainput with the second being a reference voltage. The data input voltagemay be within approximately 0.1 volts of the reference voltage. Theproblem of such small voltage differences is solved by utilizing fourinputs. The data input, defined as BIT, is connected to two inputs tothe differential amplifier and the other two inputs are connected to tworeference voltages called DMY0 and DMY1. The effective reference voltageis between the DMY0 voltage and the DMY1 voltage. The effectivereference voltage level can be shifted by changing the width-to-lengthratio of the FETs connected to DMY0.

In the present invention, reducing the width-to-length ratio increasesthe bit input negative noise immunity with some decrease in voltage gainof the amplifier. The high gain in the CMOS differential amplifier isused for increased memory speed and can be sacrificed to some extent forthe greater immunity to the bit input noise voltage. Automaticpower-down to zero power while retaining the data is also achieved.

Refer now to FIG. 21 which shows a schematic of the sense amplifier. Thesignal DMY0 is a dummy bit line in a ROM core as described above whichhas been programmed to prevent DMY0 from discharging during a readcycle. DMY0 is precharged as are all the bit lines to the prechargevoltage, VPC. Again, DMY0 has a PN junction leakage current and couplednoise voltages which simulate those of a bit line in the main memorycore and in the DMY1 line. DMY1 is similar to DMY0 except that the ROMcells coupled to the DMY1 line are programmed to discharge DMY1 to avoltage level of about 0.2 volts below the precharge voltage, VPC. DMY0is connected to the gate of FET 312 while DMY1 is coupled to the gate ofFET 314. DMY0 serves as a logical zero reference voltage and DMY1 servesas a logical one reference voltage. The effective reference voltage is alevel between the DMY0 and DMY1 levels.

The signal, BIT, is coupled to the gates of both FETs 316 and 318. Thedifferential amplifier is comprised of the transistors 312-338. Thedifferential amplifier compares the parallel conductance (resistance) ofFETs 316 and 318 to that of FETs 312 and 314. FET 320 provides aconstant current source for the differential inputs of FETs 312-318.PFETs 328 and 330 provide a current mirror function for the basicdifferential amplifier.

In one embodiment, FET 312 has a slightly longer channel length thanthat of FETs 314-318 and therefore a lower channel width-to-lengthratio. The input signal bit may have some negative noise voltage on itand still balance the amplifier since FETs 316 and 318 have a combinedwidth-to-length ratio greater than that of FETs 312 and 314. Thisfeature is novel to the present application. In the preferredembodiment, FETs 312-318 all have the same channel dimensions to achievethe best memory speed with adequate negative noise immunity.

The overall structure of the differential amplifier having now beendescribed in the schematic of FIG. 21, turn now to its operation whichcan be described in four phases. The method of operation is comprised ofthe steps of:

(1) precharging the ROM core, DMY0, DMY1, and the eight lines carryingthe signals BIT;

(2) sensing the ROM core to discharge DMY1 and, depending upon theprogram data, the bit lines;

(3) latching the data; and

(4) automatically powering-down the sense amplifier of FIG. 21 andretaining the latched data.

Consider first the step of precharging the ROM core including the DMY0,DMY1 and BIT lines. Near the beginning of the read-only cycle, theprecharge clocks PC0, PC1 and PC2 in the memory circuit are either highfrom the previous read cycle or have been switch high to precharge theROM. The time duration of precharge is controlled by a circuit in theROM called PCOK described above. The clock PC2 precharges DMY0 and DMY1and the eight bit lines to the precharge voltage, VPC. FET 322 is gatedby PC2. Since FETs 324 and 326 are turned on by a signal, SLIN, thenodes 340, NSLQ, and 342, SLQ, are equalized to the same voltage levelwhile PC2 is high by means of FETs 322, 324 and 326. As long as the PC2clock is high, the output nodes 340, NSLQ, and 342, SLQ, remain at theequalized voltage level and do not respond to the inputs of the signalsbit, DMY0 and DMY1.

The signal, SLIN, is high during precharge and while sensing the signalsBIT, DMY0 and DMY1 inputs. When the data is latched by the signal, SLCH,as described below, SLIN switches low to disconnect the Y decode in ROMcore from the sense amplifier. The signal, SLCH, is a signal which islow during precharge and sensing, and then is switched high to latch thedata defined by the voltage levels on nodes 340, NSLQ, and 342, SLQ, atthe start of the latch operation.

One feature of the invention is the maintenance of the input clock PC2high until the input BITS, DMY0 and DMY1 are free of noise and/or havereached an appropriate voltage level for sensing. By this means, theoutputs at nodes 340, NSLQ, and 342, SLQ, are preset to equal voltagelevels from which they can quickly respond to the input signals.

The ROM core, DMY0, DMY1 and BIT now having been precharged and a senseamplifier similarly preconditioned to receive these inputs, consider nowthe step of sensing the ROM core. Upon completion of ROM coreprecharging, PC0, PC1, and PC2 are sequentially switched low in theorder stated. Address decoding is completed during the precharge phaseto select: (1) the sector of ROM core to be sensed; (2) the word linewithin the sector; and (3) the bit virtual ground lines within thesector which will be selected. After PC1 is switched low, the eightselected virtual ground lines, and the virtual ground line for DMY1, areswitched low by an internal clock signal, SELV. DMY1 then startsdischarging relatively slowly toward ground, while DMY0 remains at aboutthe precharge voltage level, VPC. The eight bit lines, connected fromthe Y decoder to the eight sense circuits, will discharge in a mannersimilar to the discharge rate of DMY1 or remain at about the DMY0voltage level depending upon how the selected ROM cells are programmed.

Consider now what happens when the bit signal remains at the DMY0 level.At the start of the sensing phase, DMY0, DMY1 and BIT are at or near thevoltage precharge level, VPC. With FETs 318 and 316 having a combinedwidth-to-length ratio greater than that of FETs 312 and 314, the inputsignal BIT will drive the node 342, SLQ, to a lower voltage than node340, NSLQ. As DMY1 ramps relatively slowly downward to about 0.2 volts,the parallel conductance of FETs 312 and 314 becomes less, node 340,NSLQ, is driven higher, and node 342, SLQ, is driven to a lower voltagelevel. At the time of the starting of the data latching operation, thenode 340, NSLQ, is typically more than 1 volt higher than the voltagelevel at node 342, SLQ.

On the other hand, consider now what happens when the signal, BIT,discharges in a manner similar to DMY1. Both the signals BIT and DMY1ramp relatively slowly from the initial precharge voltage, VPC, to about0.2 volts below DMY0. With the input bit coupled to both FETs 316 and318, the parallel conductance of these FETs is initially greater thanFETs 312 and 314. Therefore, as bit ramps downward with DMY1, theconductance of 316 and 318 becomes less than that of FETs 312 and 314.FETs 312 and 314 then drive node 340, NSLQ, to a level below node 342,SLQ. In the illustrated embodiment, node 340, NSLQ, is driven to avoltage level lower than node 342, SLQ, by approximately more than onevolt at the time when the data latching operation begins.

Consider now the step of latching the data. A circuit, TRIG, describedabove, detects when DMY1 is about 0.2 volts below DMY0. When thisoccurs, another circuit, called output control, OUTCNTL, describedelsewhere in this specification, sequentially and quickly switches thesignal, SLCH, high, then the signal SLIN low, and then the signal, SLPD,high. SLPD is low during precharge, sensing and latching of the data andthen switches high. The high level reduces the dissipation of the senseamplifier to zero, as will be described below, while the latched data isretained.

As SLCH switches high, FET 344 which is gated by SLCH, drives the sourceterminals of FETs 346 and 348 toward ground. For a logical one, node342, SLQ, is at a higher voltage level than node 340, NSLQ, at thistime. Therefore, FET 348 conducts more current than FET 346. FET 348therefore drives node 340, NSLQ, toward ground faster than FET 346drives node 342, SLQ, toward ground. The result is that FET 346 isturned off and node 340, NSLO, is driven low by FET 348.

Next, as a signal SLIN switches low, PFET 350, which is gated by SLIN,drives the source terminal of FETs 352 and 354 high. Since node 340,NSLQ, is held low by FET 348, FET 352 conducts a higher current than FET354. FET 352 then drives node 342, SLQ, to the supply voltage level,VDD. Also, as a signal SLIN switches low, FETs 324 and 326 are turnedoff which isolates the input FETs 312-318 from the latch circuit. Thisprevents the subsequent precharging of the signals bit, DMY0 and DMY1from effecting the latched data.

For a logical zero, node 340, NSLQ, is initially at a higher voltagelevel than node 342, SLQ, and node 340, NSLQ, will remain higher thannode 342, SLQ, after completion of these latching operation. Since thelatch circuit comprised of FETs 344-348 and 350-354 is symmetrical, thelatching operation is reversed for logical zero as compared to that of alogical one as described above.

However, one difference in the latching of the logical zero from that ofa logical one is that node 342, SLQ, does not switch to a good groundlevel until the signal SLPD switches high and turns off PFET 334. Thecurrent path to the supply voltage VDD exists through FETs 328, 334 and336 before FET 334 is turned off by the control signal SLPD.

Consider now the step of powering-down the sense amplifier. The inverterchip enable signal, NCE, when low allows the sense amplifier circuit tobe connected to VDD for operation. However, when NCE is high, most ofthe ROM is powered-down along with the sense amplifier. Specifically,when NCE is high, FETs 336 and 338 are switched off. There is no currentpath from the supply voltage VDD to ground so that power dissipation iszero.

When NCE is low, there is an automatic power-down as follows. When thesignal SLPD switches high, FETs 332 and 334 are switched off. The latchcircuit comprised of FETs 344-354 drives nodes 342, SL0, and 340, NSL0,to VDD or ground depending upon the data latched. With the controlsignal SLIN low, and the control signal SLPD high, there is no currentpath from the supply voltage, VDD, to ground so that power dissipationis zero for the remainder of the memory cycle.

A Low Noise X Decoder Circuit for Use in a Semiconductor Memory

In a very large scale memory undesired accumulated voltages can build upon dynamic nodes from capacitive coupled noise in a multiplicity ofdevices coupled to the clocked nodes even when almost all of the devicesare nominally off. By providing a transistor which discharges thedynamic node to a logical zero on every read cycle and a clampingtransistor to maintain this zero for unselected devices, such undesiredstray voltage buildups can be avoided.

The present invention suppresses a noise which arises from the dynamicnature of the X decoder circuit in combination with a large number ofcells tied to a particular clock or series of clocks which areillustrated in FIG. 2-3 as clock signals WSA, WSB, WSC, WSD and PUMP aswell as to lessor degree clock signals of the type shown in FIG. 24illustrated by signals CDCK, CSA and CSB. The nature of these clocksignals will become apparent in the description that follows. The noiseproblem becomes particularly acute in very large memory arrays,generally over two megabits in size. These clocks are all connected in asimilar way to the cells, that is, they are all tied to the source of anormally off field effect transistor.

In the nature of large scale memory designs, it is typical that only onesector among many sectors will be on. Also, only one block of the cells,such as the W0-W3 lines in FIG. 24, of eight possible blocks isaccessed. Therefore, each clock for example WSA-WSD, in a four megabitread-only memory which has 32 sectors, has 255 unselected NFET switchesshown as FETs 358-364 in FIG. 23. In FIGS. 22A and 22B, a block diagramis illustrated which shows the word lines, W0 through W31, decoded bydecoders 356 having the clock signals WSA-WSD, and PUMP as inputs. Thus,only one of the blocks 356 in a four megabit ROM will be accessed.

The schematic of one of the blocks 356 in FIG. 22A and 22B isillustrated in schematic diagram of one of the word line drivers 356 inFIG. 23. Each of these word line drivers 356 includes FETs 358, 360,362, and 364 having their sources coupled to the clocks WSA-WSD. If theword line driver happens not to be the one which is accessed, then therewill be 255 such unaccessed NFET switches 358 in the block diagram ofFIG. 22A and 22B and one only accessed NFET switch 358. So for examplefor the WSA clock, FET 358 has a high gate voltage on only one of thetotal of 256 FETs 358 tied to it, that is in 32 sectors of eight blockswhich are tied to WSA. The other 255 FETs 358 will have a low gatevoltage. The problem that arises from this is that when a large numberof FETs 358-364 from various sector blocks are connected to the clocksWSA-WSD in NMOS decoders, the off level or low voltage is prechargedonto the selection node 366 and the on level is precharged onto thedeselection node 363. These dynamic nodes are sensitive to noise.

In particular, if any positive noise voltage is encountered on the 255unselected selection nodes 366, small but significant parasitic leakagepaths are opened to the clock signal simply due to the large number ofFETs involved, though the contribution of each FET may be relativelysmall. This noise is induced onto nodes 366 through gate-to-sourceoverlap capacitance and interconnection overlap capacitance with theclocks, PUMP, CDCK, and CSA or CSB as depicted in FIG. 24, which shows acolumn select driver, or for the word line driver of FIG. 23 for theclocks PUMP, WSA, WSB, WSC or WSD.

Even if the noise is not sufficient enough to turn the unselected FETsin question on, a considerable increase in leakage is developed viasubthreshold currents when the voltage on node 366 is coupled positivetoward the threshold voltage from its precharge level at ground. Again,although these subthreshold currents are very small, they becomesignificant due to the large number of cells coupled in parallel. Theresult is the clocks have longer rise times as well as reducedamplitudes.

Turning to FIG. 23, according to the invention, transistor 376 isincluded in the circuit of the word line driver 356 while transistor 374is included in the circuit of column select driver of 357 shown in FIG.24. The addition of these two discharging FETs ensures that all nodes366 and 370 will be discharged to ground at the start of each memoryread cycle.

To illustrate this, consider a memory cycle. In the unaccessed sectors,node 366 and node 370 will be precharged low through FETs 376 and 374 bythe precharge word control signal, PCWD. After PCWD goes low, a timeperiod is allowed for one node 366 and one node 370 in the array to bedriven high through FET 372 and FET 386 respectively while all the other255 nodes 366 and 31 nodes 370 remain low strictly due to the straycapacitance on these nodes if FETs 379 and 381 were not included in thedesign of these circuits. After that period has transpired, one of theWS clocks, one of CS clocks, CSA or CSB in FIG. 24, clock signal CDCKand a clock signal PUMP will go from an off state to an on state. Assumefor example that it is WSA, CB, CDCK and PUMP that goes high. Due to thesource-drain overlap capacitances of FET 358 and FET 378 in FIG. 23 aswell as FETs 380-384 in FIG. 24, nodes 366 and 370 will experience noisecoupling thereby causing them to rise above their ideal zero voltagelevel. Because of the large quantity of these FETs tied to each clock,even a small voltage increase at the gate will cause increased leakageacross these ideally off switches and will have a significantdetrimental effect upon the clock rise time and amplitude due to theleakage.

Now consider FET 379 in FIG. 23 and FET 381 in FIG. 24. These FETs actas noise clamps on all unselected devices and discharge any positivenoise on the nodes 366 and 370. For unselected devices, node 363 and 383are logic high and positive noise on nodes 366 and 370 can be dischargedthrough FETs 379 and 381. For selected devices, node 363 and 383 arelogic low and FETs 379 and 381 are not active.

Because of the discharging FET 376 added to word line driver 356 shownin FIG. 23 and FET 374 added to column select driver 357 in FIG. 24, thebuild up of charge is dissipated on every read cycle. The noise clampingFET 379 added to word line driver 356 shown in FIG. 23 and FET 381 addedto word line driver 357 shown in FIG. 24 discharge the noise from theswitching of the clocks WSA-WSD, PUMP, CDCK, CSA and CSB from thedynamic nodes 366 and 370 for unselected devices. These four FETs ensurethat no accumulation of charge or substantial leakage currentcollectively arises.

Improved Time Constant Generation Circuit

A stable timing signal can be generated using less costly and inherentlyless stable integrated circuit RC delay elements by generating thetiming signal from a node, which is discharged through the range of thevoltage supply coupled to the output of the RC delay element. By basingthe generation of the time signal on the basic timing node in a timingcontrol circuit on the time when the basic timing node achieves avoltage in a discharge state, increases in the supply voltage of the RCdelay element can be used to offset changes in switching speeds ofcorresponding circuit elements coupled to the RC delay element and othernodes within the timing circuit. The supply voltage may in fact bedirectly offset by one or more device threshold voltages by coupling thebasic timing node to the voltage supply, VDD, through a thresholdvoltage of one device and to ground through a second device.

The invention is comprised of an RC timing element in conjunction with aset of transistors to control the RC timing ramp voltage progression andto detect the end of a timing progression in such a way to cancel outvariations in the circuit elements and to generate a stable time periodwhich is more insensitive to voltage and temperature variations than anyof the individual elements in the circuit. The result is an accuratetiming signal available at a fraction of the cost of other moreexpensive approaches considered in the prior art.

The conventional approach to providing an RC based time constant circuitis to use the most linear portion of the RC time charging curve incombination with the most accurate circuit references or thresholds toobtain the most accurate time period possible.

Comparison of FIGS. 25 and 26 will make the differences in the approachof the invention clear. FIG. 25 is a time graph of the voltage at asignal or output node in a prior art timing circuit in a semiconductormemory. The voltage varies from ground or zero at what has been definedas the zero time shown as time point 386 in FIG. 25 and charges upthrough a time delay to a saturation voltage level 388 which istypically at the supply of voltage level VDD, less the threshold voltagenecessary to turn on a driving transistor, which is used to drive thelines toward the supply voltage, VDD. The output will typically triggerat a threshold voltage VTN1 shown as voltage level 390 in FIG. 25 atvoltage level 392 above ground at time 394. As a variation supplyvoltage arises, typically the speed of the circuit elements increasestoo so that slope of the linear portion 396 of the curve of FIG. 25increases causing the threshold time TA, 394, to move toward the originor shorten.

FIG. 26 graphically illustrates the approach of the invention. Thenonlinear portion of the decay curve of FIG. 26 begins from the supplyvoltage VDD minus a threshold voltage VTN4 and decreases until thethreshold voltage 398 is reached, which threshold voltage is defined asthe trigger point for the timing circuit output at a time TB 400. Inthis case, the voltage difference 402 which must occur is the differencebetween the supply voltage VDD and two threshold voltages VTN3 and VTN4.

As the supply voltage, VDD varies upwardly, for example, the slope ofthe decay curve will tend to increase, but since the beginning voltageis higher, the threshold point VTN3 398 is reached approximately at thesame time TB 400 as before, this is represented by a first curve 404 insolid outline in comparison to a second curve 406 shown in dottedoutline.

The invention is illustrated in one example by the comparison of themethod operated according to the prior art circuit of FIG. 27 as opposedto the current invention as operated in the circuit of FIG. 28, eachhaving the respective timing diagrams shown in FIGS. 29 and 30respectively. The initiating timing signal, OD, is input to a firstinverter 408 in embodiment of FIG. 28 and through an input inverter 410to first inverter 408 in the prior an methodology described inconnection with FIG. 27. The output of a second inverter 412 in FIGS. 27and 28 is provided to a node A, 414 illustrated in FIGS. 27 and 28.

When initiating signal OD goes active high as shown on curves 416 inFIGS. 29 and 30 at a time T0, 418, node A, 414, will go low at a latertime indicated by curve 420 in FIG. 30, while node A, 414, in FIG. 27will go high as depicted by curve 422 in FIG. 29. The signal at node Ais then propagated through an integrated circuit RC delay element 424 inFIGS. 27 and 28 whose output is designated as node B and is illustratedby curve 426 in FIG. 30 for the circuit of FIG. 28 and by curve 428 inFIG. 29 for the circuit of FIG. 27. Thus, as is evident from FIG. 30,curve 426 shows an RC time decay. Curve 428 of FIG. 29 shows an RCcharging curve.

In the circuit of FIG. 28, inverter 430 will be triggered at a time TBindicated by time 432 in curve 426 of FIG. 30 when the voltage decays tothe trigger point. In the prior art, the circuit of FIG. 27 inverter 434will be triggered when the voltage reaches a threshold point at time TA436 shown on curve 428 of FIG. 29.

The identical output point, node C, 438, in the circuitry of FIGS. 27and 28 will thereby trigger high in response to trigger point 432, TB,as illustrated by curve 440 in FIG. 30 corresponding to circuit of FIG.28 or as illustrated by curve 442 in FIG. 29 which is triggered high bytrigger point TA 436 of curve 428 for the circuit in FIG. 27.

Therefore, as can be seen by comparing FIGS. 29 and 30, the identicalinput signal shown by curve 416 is processed in different ways as shownby the intermediate steps to generate the same result as shown by curves440 and 442 in FIGS. 30 and 29 respectively, and in a substantiallydifferent manner with the result that the methodology as discussed inconnection with the circuitry of FIG. 28 and depicted in FIGS. 26 and 30provides a stable time signal based on conventional integrated circuitRC time delay elements whereas the prior art does not.

In the prior art, the voltage differential 392 shown in FIG. 25increases as the circuit parameters due to temperature and processvariations cause the circuits to become slower. This increases the timeperiod of decay for the RC delay since the charging time constant of thecharging curve of FIG. 25 is directly proportional to the voltagedifference 392.

According to the invention, as temperature and process parameters causethe devices to slow, the voltage difference 402 varies even more greatlythan voltage 392, but in such a way as to cancel the time variation ofthe integrated circuit parameters. In the slow case, the thresholdvoltage VTN4 and VTN3 will be at their maximum while VDD will be at itsminimum. Therefore, the voltage 402 will be at its minimum.

In a situation where temperature variations and process variations causethe device speeds to increase, VTN4 and VTN3 will be at their minimumand VDD will be at its maximum so that the voltage difference 402 willbe at its maximum. Therefore, a time delay period will be small in slowcircuits and larger in fast circuits. The reduction in time delay of theRC network then adds to the increase in time delay for the slowercircuits to cancel each change in delay.

Table II summarizes the general relationship between supply voltagelevels, threshold voltage levels, temperature and process variationsbetween situations where the circuit elements are fast as opposed towhen they are slow. The total circuit time is therefore the circuit timeof the connected auxiliary circuits together with the circuit delayarising from the RC timing circuit as exemplified in FIGS. 27 and 28.The equations below show how the times add for fast and slow circuits inthe prior art approach of FIGS. 29 and 27 as opposed to the approach ofthe current invention shown in FIGS. 30 and 28. The variation in the RCdelay according to the invention is therefore opposite to the variationin time caused by fast or slow parameters in the associated amplifyingand other circuits. With good device models and simulators, the timingcircuit can be tuned to cancel a substantial portion of the oppositelyvarying time performance in the associated circuits, therefore,resulting in a much more stable and constant timing circuit.

                  TABLE II                                                        ______________________________________                                        circuit condition                                                                          Vdd    Vth        temp tic                                       ______________________________________                                        FAST         max    min        min  min                                       SLOW         min    max        max  max                                       ______________________________________                                    

where tic is the time delay of the integrated circuit.

Total circuit time=tic+K/RC (Vdd-Vth4-Vth3); as compared to theconventional circuit of

Total prior art circuit time=tic+K/RC (Vth1);

Therefore,

total circuit time=(min)+K/RC (max-min-min) for the fast case; or

total circuit time=(max)+K/RC (min-max-max) for the slow case.

This compares to the prior art circuit as:

total circuit time=(min)+K/RC (min) for the fast case; or

total circuit time=(max)+K/RC (max) for the slow case.

FIG. 31 represents another circuit for producing SURG described above inwhich the same methodology is used. For purposes of comparison, samenodes A, B and C have been referenced in FIG. 31 whose operation isidentically described by the timing diagram of FIG. 30. Note that inthis case the falling edge of OD and an extra inverter are used toproduce the same nodes A, B, and C. The methodology of the invention canbe employed both in NMOS circuits such as shown in FIGS. 27 and 28 aswell as CMOS circuits.

Memory Circuit Yield Generator and Timing Adjustor

Incremental values of a plurality of capacitors are programmably coupledthrough ROM core FETs with selective threshold voltages, EPROM coreFETs, RAM cells, ROM fuse links or antifuse ROM links to a dummy bitline. The dummy bit line carries a bit line voltage to simulate eitherthe worst case logical one or worst case logical zero within a read-onlymemory array of memory cells. The dummy bit line voltage is used as acontrol signal to a trigger circuit. The trigger circuit generates atthe appropriate threshold a triggering signal used to control senseamplifiers coupled to the memory circuit. Therefore, by programmablyaltering the delay time on the dummy bit line, the read cycle of thememory can be programmably altered to either minimize the read timecycle to provide a fast, high quality memory product, or to maximize theread time cycle to provide for a slower but higher yield memory productat less expense.

The use of programmable capacitors incrementally included within acircuit is well known and has been used in circuits such as analog todigital converters. However, never before has programmable capacitorsbeen used to adjust or tune the critical timing functions within amemory circuit to a customer's requirement so that the sense timingperiod is particularized. The sense timing period is defined as the timeafter which all conditions are set up for memory operation and beforethe sense amplifier is instructed to attempt to resolve the presentedvoltages to determine whether one or zero was read. Previously, thesetime elements were adjusted or traded off manually when the circuit wasinitially designed and thereafter only rarely in any attempt to finetone a circuit to particular specification. There was no prior artattempt to program or adjust a specific product to an application in anyfashion that allowed its universal or automated adjustment.

The circuit uses graduated capacitor sizes to vary the sense time periodin a memory circuit in order to adjust the time allotted in the memorycycle for the bit line voltage drive either to minimize this time toprovide a fast, high quality memory product, or to increase the time fora slower memory product which has higher yield and, therefore, lesscost.

The circuit allows for adjustment in a particular memory application,but also uses the device through which the programmability isimplemented, such as the ROM core FET, EPROM core FET, or RAM cell ROMfuse link or antifuse ROM element, to allow the speed and yield tradeoffto be made at the time of manufacture or even in a final product insidethe application device so that the customer's product may be moreoptimally matched without any increase in the number of memories whichneed to be inventoried.

The invention is a means through which chip manufacturers may add orsubtract specific increments of time to or from a memory sense cycle toimprove the sense amplifier resolution and, therefore, the device yieldby providing more settling time, or may improve the speed specificationof the product with less settling time and consequently less yielddepending upon the specifications of the circuit and cost requirements.The circuit thereby provides a programmable automated adjustment totailor the memory cycle periods to the particular specifications orcustomer's needs for the memory product.

Turn now to FIG. 32 which is a schematic of a circuit used in theinvention. The circuit of FIG. 32 provides for varying sizes ofcapacitors of incremental values such as doubling multiples of a basevalue, C, shown in FIG. 32 as capacitances C, 2C, 4C, 8C. The methodprovides a means of programmably coupling the capacitances into aportion of the circuit which determines the delay time. The methodologydepicted in FIG. 32 may be employed either using fusible or lasercuttable metal straps, or programmable transistors along with circuitryto set the capacitor voltage level to an optimum starting point forcircuit operation.

The specification of the maximum memory access time of a semiconductormemory must be made by the customer at the time the memory is ordered orspecified. Choice of memory access times is performed in the art bychoosing from a variety of access time specification ranges which arecompatible with other portions of the circuitry. The largest maximumaccess time possible with that which would reliably allow the finalproduct to operate to the customer's specification is selected. However,the maximum access time selected must not be so excessively long as toincrease production costs which typically varies inversely with thespecified maximum memory access time of the memory product. The amountof additional time beyond a minimum set time for a particular memoryproduct is determined and added to the sense period of the memory cycle.Also the access time must not be so long as to exceed the specificationfor typical operating conditions given allowable process tolerancevariations and operating drift. The various combinations of capacitancesare selected and coupled to the time sensitive node within the circuityto establish the sense time.

In other embodiments, the memory time period may be varied by varyingthe sizes of certain field effect transistors in the time generatingcircuit or trigger circuit. However, variation of FET sizes do not havethe advantage of being programmable as is proposed in the preferredembodiment.

The general approach to the problem now having been described, turnspecifically and consider the operation of the circuit of FIG. 32. FETs444-450 are transistors which allow for programming the memory ofintegrated circuit capacitive elements 452-458. The capacitances ofthese elements are coupled to, for example, a memory node 460, denotedas DMY1. Links 462-468 are shown as an alternative embodiment ascomprising laser cuttable or fusible links to perform a function similarto FETs 444-450 respectively. FETs 444-450 and/or links 462-468 allowselective connection of the insertable elements to the desired node byeither implanting at threshold voltages to a high voltage level or off,or not implanting them and leaving their threshold voltages low or on.The combination of different programmable elements can be used in thecircuit of FIG. 32 although in any practical embodiment, only one singletype will be chosen. In a read-write (RAM) memory, FETs 444-450 wouldtypically not be programmable, but would be driven by the output of anaddressable RAM register latch or links 462-468 would be used withoutFETs 440-450.

Transistors 470-476 are preconditioning transistors coupled to thecapacitor plate voltages prior to the memory cycle operation.Transistors 470-476 are controlled through their gates by prechargecontrol voltage PC2 to couple the precharge voltage, VPC, to thecapacitive elements 452-458. FETs 444-450, in turn, are coupled to thesupply voltage Vet and are held either in the off or on state dependingupon their programmed threshold voltage.

Table III below shows the delay times which can be set on node 460depending upon the programmed states of FETs 444-450.

                  TABLE III                                                       ______________________________________                                        F3       F2    F1         F0  time delay                                      ______________________________________                                        X        X     X          X    0 RC + RCo                                     X        X     X          0    1 RC + RCo                                     X        X     0          X    2 RC + RCo                                     X        X     0          0    3 RC + RCo                                     . . .                                                                         . .                                                                           0        0     0          X   14 RC + RCo                                     0        0     0          0   15 RC + RCo                                     ______________________________________                                    

where

0=programmed as a short;

X=programmed as an open circuit;

R is the resistance of the charging path of the node DMY1; and

Co is the inherent capacitance on the node DMY1.

FIG. 33 is an overall block diagram of a memory circuit utilizing theinvention of FIG. 32. The memory includes a memory core 478 which isaccessed through address receivers, decoders and buffers 480. Theaddress inputs from circuits 480 are coupled to an X-decoder 482 andY-decoder 484. Data accessed in memory core 478 is output to a senseamplifier 486 and then to output buffers 488.

Timing of the memory access cycle is determined through a plurality oftiming control signals generated by a timing generator 490 whose variousoutputs are coupled to each of the circuit elements in FIG. 33.

Memory core 478 is appropriately sensed or read out by utilizing atleast two dummy lines, DMY0 and DMY1, to accommodate for device leakage,capacitor loading, transistor characteristics and other artifacts whichoccur in a real integrated circuit memory. The dummy lines or nodes arecoupled to a trigger circuit 492. The output of the trigger circuit, inturn, provides an appropriately timed trigger output signal to senseamplifier 46 to indicate when the memory 478 can be properly read.

As shown in FIG. 33, one of the dummy lines, in this case chosen asDMY1, is coupled to memory device circuit 494 so that the capacitanceand hence time delay which is seen by trigger circuit 492 isprogrammably determined by means described in connection with thecircuit of FIG. 32. Yield generator circuit 494 inserts a programmableamount of capacitance onto the DMY1 node 460. The voltage differencebetween DMY1 and DMY0 nodes represents the best approximation of theworst possible voltage differential between a logically programmed oneand a logically programmed zero in memory array 478. Trigger circuit 492generates a sense amplifier trigger pulse, TRIG, when this voltagedifferential reaches a predetermined magnitude. This predeterminedmagnitude provides a yield enhancing noise margin to the sense amplifieroperation. The worst bit line voltages for a logical one will be belowthe DMY1 line, while worst bit line voltage for a logical zero will beabove the DMY0 line. The sense amplifier is constructed such that theresultant demarcation point is approximately half way between the DMY0and DMY1 voltages.

The original memory design of the prior art only provided thepredetermined minimum voltage margin for adequate sense amplifierresolution between a one and zero. However, the present invention addssmall capacitances to DMY1 so that the apparent worst logical one isdelayed by an additional time, dT, so that an additional voltage margin,dV, between the worse case programmed one and programmed zero isgenerated with most of the margin favoring a programmed one.

This point is best illustrated in the graph of FIG. 34 wherein voltageis plotted against time. The DMY0 line as a function of time is graphedas line 496. The DMY1 node is graphed on line 498. The original triggerpoint is at the time T1 denoted by point 500. By delaying a time periodof dT to the time period T2, labelled as point 502, the voltagedifferential between the DMY0 and DMY1 lines increases from thedifferential denoted by the interval 504 to the larger interval denotedby reference numeral 506.

In the circuit of FIG. 33, DMY1 and DMY0 represent as accurately as ispractical, the worst (highest voltage) programmed logical one and theworst (lowest voltage) programmed logical zero, respectively. It canthus be understood that the additional time dT allows the bit line whichis programmed for logical one to have an additional voltage marginsimilar to the added voltage margin indicated by the reference numeral508 in FIG. 34 for the DMY1 node.

To improve circuit matching and balancing, a similar device is added tothe DMY0 node and is programmed identically by yield generator 494 inFIG. 33. This improvement not only provides for better balancing of thecircuit, but also provides a means to add noise damping capacitance tothe DMY0 node which can be very noise sensitive.

FIG. 35 is a time graph of voltage similar to that of FIG. 34 whereinthe effect of providing a similar programmable capacitance to the DMY0node is illustrated. In this situation, curve 510 represents the delaycurve for the DMY0 line after additional capacitance has been added tothe node. This causes a shortening of the delay time to a time T3indicated by point 512 which improves the read access time of the ROM bythe same amount. The margin for a logic one is indicated by dV1. Addingcapacitance on DMY0 reduces the voltage margin for a logic one by dV-dV1and reduces the margin for a logic zero by the mount dV2 shown in FIG.35.

Therefore, the invention must be understood as being usable to insertvariable capacitances to any memory circuit nodes to adjust time ordampen noise as may be required by the circuit demands.

Many modifications and alterations may be made by one having ordinaryskill in the art without departing from the spirit and scope of theinvention. Therefore, it must be understood that the describedembodiment has been set forth only for the purposes of illustration andexample and should not be read to limit or restrict the invention whichis defined by the following claims. The claims are to be construed notonly to include the reasonable scope of the literal meaning of the wordsand terms used therein, but also to include elements not literallyincluded if those elements are in whole or in part equivalent to theclaims as a whole, elements in the claims, or subcombinations ofelements in the claims. The claims are thus to be interpreted asequitably including all other embodiments which in essence incorporatethe novel concept of the claims.

We claim:
 1. An improvement in a method for generating a delayedprecharging signal in a memory having word lines which are selectivelydischarged comprising the steps of:precharging a dummy word line high;presetting a timing control signal OWDN low; discharging said dummy wordline low; switching said timing control signal OWDN high when said dummyword line has been discharged low, said dummy word line being dischargedsufficiently to allow an end of said selected word line to discharge toground; and initiating a precharge clock signal, PC0.
 2. The improvementof claim 1 where said step of initiating said precharge clock PC0initiates the first one of a series of sequentially trigger prechargeclock signals including PC0 and PC1 used to precharge said memory. 3.The improvement of claim 1 wherein said dummy word line is comprised ofa plurality of dummy line segments and where said step of prechargingsaid dummy word line high comprises the step of simultaneouslyprecharging each of said segments high and said step of discharging saiddummy word line segment low comprises the step of sequentiallydischarging said plurality of segments, said plurality of segments beingcoupled in series for discharge purposes.
 4. The improvement of claim 1further comprising the step of preventing power dissipation in a timingcontrol circuit after said timing control signal OWDN is switched high.